Manufacturing method of ic radio frequency package structure and ic radio frequency package structure
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., and can solve problems such as poor antenna structure accuracy, antenna stability cannot be guaranteed, and chip-related circuit damage, etc.
Active Publication Date: 2020-10-27
FOREHOPE ELECTRONICS NINGBO CO LTD
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Problems solved by technology
In the prior art, the antenna can only be formed by laser slotting and printing on the surface of the plastic package where the chip is located. The slot will be dug first to leak the circuit layer and the antenna pattern layer from the bottom of the substrate. After filling the slot with a conductive adhesive layer, Antenna printing process
Once the laser energy is too large or the groove depth is not well grasped during the production process, it is easy to cause damage to the chip-related circuits (such as the circuit layer at the bottom of the substrate), which also makes the obtained antenna structure less accurate, which makes the existing IC radio frequency The packaging structure does not guarantee the stability of the antenna
Method used
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[0053] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0054] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...
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Embodiments of the present application provide a method for manufacturing an IC radio frequency packaging structure and an IC radio frequency packaging structure, which relate to the technical field of IC radio frequency antennas. The method for manufacturing an IC radio frequency packaging structure includes: providing a substrate, and setting a plurality of pins on one side of the substrate A connection point; a first plastic package is provided on the side where the connection points of multiple pins are located on the substrate; a protective film is provided on the side where the first plastic package is located on the substrate; an antenna is provided on the first plastic package; the protective film is removed, And set the chip on the side where the antenna structure is located on the substrate; plastic seal the chip to form a second plastic package; set the substrate circuit layer inside the substrate, and the first pin connection point and the second pin connection point are electrically connected through the substrate circuit layer , The IC radio frequency packaging structure includes a substrate, an antenna structure and a chip structure, and an IC radio frequency packaging structure with a stable antenna can be obtained.
Description
technical field [0001] The present application relates to the technical field of IC radio frequency antennas, and in particular, relates to a manufacturing method of an IC radio frequency packaging structure and an IC radio frequency packaging structure. Background technique [0002] At present, IC radio frequency antennas are widely used in the semiconductor field, and with the iteration of high-frequency and low-frequency signals in the current communication field, corresponding products also need to be equipped with transmitting antennas and feedback antennas. In the prior art, the antenna can only be formed by laser slotting and printing on the surface of the plastic package where the chip is located. The slot will be dug first to leak the circuit layer and the antenna pattern layer from the bottom of the substrate. After filling the slot with a conductive adhesive layer, Then use the antenna printing process. Once the laser energy is too large or the groove depth is no...
Claims
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IPC IPC(8): H01L23/31H01L23/66H01L21/56
CPCH01L21/561H01L23/3121H01L23/66H01L2223/6677
Inventor 庞宏林何正鸿
Owner FOREHOPE ELECTRONICS NINGBO CO LTD