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a retaining ring

A technology for retaining rings and rings, applied in the direction of working carriers, metal processing equipment, manufacturing tools, etc., can solve the problems that affect the service life of the retaining ring, drop grains and degumming, etc., to solve the problems of grain loss and degumming, and improve the service life Effect

Active Publication Date: 2022-05-17
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art, due to the large seam between the rigid ring and the elastic ring, grain loss and degumming occur during use, which seriously affects the service life of the retaining ring.

Method used

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Experimental program
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Effect test

Embodiment 1

[0055] The present embodiment provides a holding ring, such as Figure 1 、 2 And 3, the holding ring comprises a first ring 5 and a second ring 6;

[0056] The bonded parts of the first ring 5 and the second ring 6 are sandblasted;

[0057] The roughness of the bonded part of the first ring after sandblasting treatment Ra is 5 μm;

[0058] The roughness of the bonded part of the second ring after sandblasting treatment ra is 6 μm;

[0059]Wherein, the first ring 5 includes a first ring concave step 1 and a second ring concave step 2 set sequentially The step surface 1.2 and the side 1.1 of the first ring concave step 1 and the side of the second ring concave step 2.1 is the bonding portion of the first ring 5; the side depth of the first annular concave step 1 is 0.12mm; the side depth of the second annular concave step 2 is 3.7mm; the material of the first ring 5 comprises stainless steel; the bonding portion of the second ring 6 is an annular convex step 3; the material of the ...

Embodiment 2

[0062] The present embodiment provides a holding ring, the holding ring comprises a first and second ring;

[0063] The bonded parts of the first and second rings are sandblasted;

[0064] The roughness of the bonded part of the first ring after sandblasting treatment Ra is 8 μm;

[0065] The roughness of the bonded part of the second ring after sandblasting ra is 5 μm;

[0066]Wherein, the first ring comprises a first ring concave step and a second ring concave step successively provided sequentially; the step surface and side of the first annular concave step and the side of the second annular concave step are the bonding portion of the first ring The side depth of the first annular concave step is 0.1mm; the side depth of the second annular concave step is 3.5mm; the material of the first ring comprises stainless steel; the bonding portion of the second ring is a circular convex step; the material of the second ring comprises PPS plastic; the step surface of the annular convex...

Embodiment 3

[0069] The present embodiment provides a holding ring, the holding ring comprises a first and second ring;

[0070] The bonded parts of the first and second rings are sandblasted;

[0071] The roughness of the bonded part of the first ring after sandblasting treatment Ra is 4 μm;

[0072] The roughness of the bonded part of the second ring after sandblasting treatment Ra is 7 μm;

[0073]Wherein, the first ring comprises a first ring concave step and a second ring concave step successively provided sequentially; the step surface and side of the first annular concave step and the side of the second annular concave step are the bonding portion of the first ring The side depth of the first annular concave step is 0.15mm; the side depth of the second annular concave step is 4mm; the material of the first ring comprises stainless steel; the bonding portion of the second ring is a circular convex step; the material of the second ring comprises PPS plastic; the annular convex step is pr...

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Abstract

The invention relates to a retaining ring, the retaining ring includes a first ring and a second ring; the bonded part of the first ring and the second ring is subjected to sand blasting; after the sand blasting, the first ring is bonded The roughness Ra of the part is 4-8 μm; the roughness Ra of the bonding part of the second ring after sandblasting is 4-8 μm. In the present invention, the roughness of the bonded part after sandblasting is strictly limited by sandblasting the bonded part in the retaining ring, so as to solve the problems of grain loss and degumming during use, and at the same time significantly improve the retaining ring. ring life.

Description

Technical field [0001] The present invention relates to the field of chemical mechanical polishing technology, in particular to a holding ring. Background [0002] At present, the wafer is contained in the holding ring of the polishing head during polishing, and the holding ring plays the role of accommodating and positioning the wafer. During the polishing process, the polishing fluid and deionized water are in constant contact with the holding ring, so the holding ring needs to have a certain degree of corrosion resistance. [0003] For example, CN205734411U discloses a CMP system and a holding ring for polishing system. In one embodiment, the holding ring for the polishing system comprises a toroidal body, the annular body having a polished inner diameter. The body having: a bottom surface, the bottom surface having a groove formed in it; an outer diameter wall; and an inner diameter wall, wherein the inner diameter wall is polished to an average roughness of less than 30 mic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/32B24C1/00B24C11/00
CPCB24B37/32B24C1/00B24C11/00
Inventor 姚力军潘杰边逸军王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD