A treatment method for improving salt spray resistance of packaged semiconductor devices

Abstract

The invention discloses a treatment method for improving the anti-salt spray ability of packaged semiconductor devices, comprising eight process steps of sand blasting, degreasing, cleaning, surface activation, protective layer plating, cleaning, dehydration and baking. The invention can coat the protective layer on the low-cost semiconductor device packaged by the metal shell, thereby effectively solving the problem that the semiconductor device packaged by parallel seam welding, energy storage welding or laser welding is damaged by oxygen, water vapor and pollutants in the atmosphere due to the destruction of the shell coating. and other corrosion components, which lead to the problem of reduced reliability, so that semiconductor devices meet the requirements of salt spray resistance; and all the equipment used in the process steps of the present invention are conventional equipment, without adding additional semiconductor equipment, with low cost and simple implementation The advantages.

Description

technical field [0001] The invention relates to the field of packaging of semiconductor devices, in particular to a treatment method for improving the anti-salt fog capability of packaged semiconductor devices. Background technique [0002] The reliability of semiconductor device packaging determines the quality level and service life of the product. Therefore, many high-reliability semiconductor devices have high requirements for packaging. In addition to meeting the requirements of internal atmosphere and mechanical tests, they also need to meet the requirements of salt resistance Fog required. In the prior art, although the shells used in semiconductor devices with high reliability requirements can meet the requirements of anti-salt spray before encapsulation, after parallel seam welding, energy storage welding or laser welding of the device shells, the protective shell coating is inevitable. It will be damaged to varying degrees, resulting in the exposure of the base ma...

AI Technical Summary

Problems solved by technology

In the prior art, although the shells used in semiconductor devices with high reliability requirements can meet the requirements of anti-salt spray before encapsulation, after parallel seam welding, energy storage welding or laser welding of the device shells, the protective shell coating is inevitable. It will be damaged to varying degrees, resulting in the exposure of the base material containing iron elements, contact with corrosive components such as oxygen, water vapor, and pollutants in the atmosphere, and after a period of storage or use, the surface of the shell will be rusted to varying degrees. Thereby reducing the mechanical strength of the shell, especially in a vibration environment, which is particularly serious, and even causes device failure

At present, there are two processing methods for this kind of high-reliability semiconductor device products. One is to apply conformal paint on the surface of the semiconductor device after installation to achieve the purpose of protecting the device, but the storage and transportation of the semiconductor device before installation , will make it in contact with water vapor, oxygen, etc. in the atmosphere. If the time is too long, even if the circuit is installed and coated with conformal paint, there will still be certain hidden dangers; the second is to coat a layer of organic protective layer on the surface of the semiconductor device, but Under the joint action of temperature and time, the organic solvent will volatilize, and the protective effect is very limited

It can be seen that the existing technology has the problem of reduced reliability of semiconductor devices packaged by parallel seam welding, energy storage welding or laser welding due to corrosive components such as oxygen, water vapor, and pollutants in the atmosphere.

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