Golden finger chamfer determination method, device and equipment and storage medium
A determination method and gold finger technology, which is applied in the formation of electrical connection of printed components, electrical components, and printed circuit manufacturing, etc., can solve the problem of waste of space in the inner layer of the PCB board, avoid signal impedance mismatch, improve rationality, reduce wasteful effect
Active Publication Date: 2020-09-08
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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Problems solved by technology
This method will not only cause waste of space in the inner layer of the PCB board, but also easily lead to problems such as figure 1 the question shown
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[0048] The core of the present invention is to provide a gold finger chamfering determination method, determination device, determination equipment and storage medium, by setting the forbidden area of each board layer according to the chamfering depth value of each board layer, compared with according to the maximum Values are used to set the forbidden area, which improves the rationality of the setting of the forbidden area, reduces the waste of space on the inner layer of the PCB, and avoids the problem of signal impedance mismatch.
[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without m...
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The invention discloses a golden finger chamfer determination method. According to a layer thickness value (a thickness value between a board layer of a target PCB and an edge board layer) corresponding to each board layer of the target PCB, a chamfering angle set value of the target PCB and a chamfering depth set value of the target PCB, a chamfering depth value of each board layer needing to bechamfered and cut is calculated; and a forbidden distribution area of the forbidden distribution copper surface of the board layer is determined according to the chamfering depth value, and the relation between the chamfering depth value of each board layer and the forbidden distribution area is established. Compared with a scheme of setting the forbidden distribution area according to the maximumvalue in the prior art, the method has the advantages that the arrangement reasonability of the forbidden distribution area is improved, the waste of the space of the inner layer of the PCB is reduced, and the problem of signal impedance mismatching is avoided. The invention also discloses a golden finger chamfer determination device, golden finger chamfer determination equipment and a storage medium which have the above beneficial effects.
Description
technical field [0001] The invention relates to the field of printed circuit board PCB design, in particular to a method, device, equipment and storage medium for determining chamfering of gold fingers. Background technique [0002] When designing a PCB board with gold fingers, chamfering will be performed on the edge of the board at the gold fingers in order to facilitate the smooth insertion of the gold fingers into the U-shaped groove of the connector. In a multi-layer PCB board, how to design the chamfering depth of each board layer will directly affect the performance of the PCB board. [0003] figure 1 It is a design rendering of a golden finger in the prior art. like figure 1 As shown, 101 is a PCB board, 102 is a copper surface, and 103 is a gold finger pin (also known as a high-speed signal pad). If the copper wire or copper surface designed in the PCB is too close to the edge of the board, the copper wire or copper surface will be cut during chamfering, causing...
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IPC IPC(8): H05K3/40
CPCH05K3/403
Inventor 王英娜
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD