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A method for nickel-plating on the surface of diamond micropowder

A diamond micropowder and nickel-plating technology, applied in liquid chemical plating, metal processing equipment, metal material coating technology and other directions, can solve the problems of many pores, non-dense, poor uniformity, etc., to achieve uniform coating, high bonding force, The effect of dense porosity

Active Publication Date: 2022-03-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem that nickel plating on the surface of diamond particles in the existing chemical nickel plating method has many pores, is not compact, poor uniformity, and the nickel layer is easy to fall off, and provides a method for nickel plating on the surface of diamond micropowder

Method used

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  • A method for nickel-plating on the surface of diamond micropowder
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  • A method for nickel-plating on the surface of diamond micropowder

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specific Embodiment approach 1

[0033] Specific embodiment one: the method for nickel-plating on the surface of a kind of diamond micropowder described in the present embodiment, it is carried out according to the following steps:

[0034] 1. Degreasing the surface of diamond powder:

[0035] Degreasing the surface of the diamond powder to obtain the degreasing diamond powder;

[0036] 2. Plasma etching of diamond powder:

[0037] Under the condition that the air pressure is 20Pa~30Pa, the flow rate of Ar is 100sccm~200sccm and the flow rate of etching gas is 30sccm~50sccm, the diamond micropowder after degreasing treatment is subjected to plasma etching treatment for 30min~60min, and the diamond micropowder after etching treatment is obtained. ;

[0038] The etching gas is CH 4 or H 2 ;

[0039] 3. Activate the diamond powder:

[0040] PdCl 2 Added to concentrated HCl with a concentration of 5mol / L~10mol / L to obtain the activator PdCl 2 Solution, put the etched diamond powder in the activator PdCl ...

specific Embodiment approach 2

[0051] Embodiment 2: This embodiment differs from Embodiment 1 in that the particle size of the diamond micropowder described in step 1 is 120 mesh to 170 mesh. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0052] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the surface of the diamond micropowder described in step 1 carries out degreasing treatment specifically according to the following steps: put the diamond micropowder into the mass percentage of In 5%-10% NaOH solution, boil for 20min-30min and then dry; the mass ratio of the diamond micropowder to 5%-10% NaOH solution is 1:(30-50). Others are the same as in the first or second embodiment.

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Abstract

A method for nickel-plating the surface of diamond micropowder, the invention relates to a method for nickel-plating diamond. The invention aims to solve the problem that nickel plating on the surface of diamond particles in the existing chemical nickel plating method has many pores, is not dense, has poor uniformity, and the nickel layer is easy to fall off. Methods: 1. Degreasing the surface of the diamond micropowder; 2. Plasma etching the diamond micropowder; 3. Activating the diamond micropowder; 4. Plating nickel on the surface of the diamond micropowder by chemical method. The invention is used for nickel plating on the surface of diamond micropowder.

Description

technical field [0001] The invention relates to a method for diamond nickel plating. Background technique [0002] Due to the characteristics of high hardness, high compressive strength, good wear resistance and excellent mechanical properties, diamond materials have been widely used in the field of abrasive tools and abrasives. However, it also has the disadvantages that it is easy to oxidize and graphitize when heated, and has a high interface energy with most metals, ceramics and resins, and is not easy to be infiltrated by it, resulting in poor adhesion between the two. Therefore, in the diamond tool, the diamond particles are only mechanically embedded in the metal matrix, and no strong chemical bond is formed between the two, which causes the diamond particles to be broken and broken during work. When the particle size is 1 / 2 of the height, it falls off from the matrix, and the diamond material actually only exerts its working capacity of less than 30%, and after the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36C23C18/18B22F1/18
CPCC23C18/36C23C18/1639C23C18/1646C23C18/1868C23C18/1882B22F1/17
Inventor 朱嘉琦王晓磊曹文鑫刘刚曹康丽代兵孙婷婷徐梁格叶之杰
Owner HARBIN INST OF TECH
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