Automatic calibration method for superconducting quantum chip parameter and related assembly

A superconducting quantum and automatic calibration technology, applied in the field of quantum computing, can solve the problems of repetitive work, low calibration efficiency, waste of labor costs, etc., and achieve the effect of less repetitive work and short calibration time

Active Publication Date: 2020-09-29
INSPUR GROUP CO LTD
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the parameters of the superconducting quantum chip are usually calibrated manually, but there are many types of superconducting quantum chip parameters, the calibration work is cumbersome and time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic calibration method for superconducting quantum chip parameter and related assembly
  • Automatic calibration method for superconducting quantum chip parameter and related assembly
  • Automatic calibration method for superconducting quantum chip parameter and related assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The core of the present invention is to provide a superconducting quantum chip parameter automatic calibration method and related components, which realizes the automatic calibration of chip parameters, has the advantages of short calibration time, less repetitive work, saving labor costs and high calibration efficiency. advantage.

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an automatic calibration method for a superconducting quantum chip parameter. In the method, the method comprises the following steps: acquiring a first range of a first calibration measurement signal of a to-be-calibrated parameter of a superconducting quantum chip and controlling a measurement device to send a plurality of first calibration measurement signals to the superconducting quantum chip in a first range; acquiring a first response parameter of the superconducting quantum chip under each calibration measurement signal; and finally, taking the first calibrationmeasurement signals corresponding to the optimal first response parameters as first actual calibration parameters of the to-be-calibrated parameter. According to the method, the problems of low calibration efficiency and the like caused by manual calibration are effectively solved, full-automatic calibration of the parameters of the chip is realized, and the method has the advantages of short calibration time, less repetitive work, labor cost saving and high calibration efficiency. The invention also discloses an automatic calibration device for a superconducting quantum chip parameter, an automatic calibration system for a superconducting quantum chip parameter and a readable storage medium. The automatic calibration device and the automatic calibration system have the same beneficial effects as the automatic calibration method.

Description

technical field [0001] The invention relates to the field of quantum computing, in particular to a method for automatically calibrating parameters of a superconducting quantum chip and related components. Background technique [0002] With the development of science and technology in recent years, superconducting quantum chip technology has achieved rapid development. After the design of the superconducting quantum chip is completed, parameter calibration is required, and it is a routine calibration, not just once. In the prior art, the parameters of the superconducting quantum chip are usually calibrated manually, but there are many types of superconducting quantum chip parameters, the calibration work is cumbersome and time-consuming, and because of its material and environmental characteristics, it needs to be calibrated frequently. Manual calibration is time-consuming, repetitive work, waste of labor costs and low calibration efficiency. Contents of the invention [...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01R31/28G01R35/00
CPCG01R31/2858G01R35/00
Inventor 刘强金长新刘幼航李清石李彦祯
Owner INSPUR GROUP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap