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A kind of packaging method of semiconductor device and semiconductor device
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A packaging method and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device components, semiconductor/solid-state device manufacturing, etc., can solve the problems of reduced thermal conductivity, electrical signal influence, and product performance, etc., to improve heat dissipation capacity, Improve stability and increase the effect of actual production capacity
Active Publication Date: 2022-08-05
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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Abstract
Description
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Problems solved by technology
[0002] At present, the existing methods of combining copper clips and chips are mainly carried out by welding, and there are the following problems in the production process: First, in the welding of copper clips, due to the characteristics (large area) of welding materials and copper clips, Since the air cannot escape effectively, there will be a large number of pores in the soldering layer between the copper clip and the chip, and the area of the pores will also increase with the increase of the soldering area of the copper clip and the chip, and the pores in the soldering layer will lead to product failure. The thermal conductivity is reduced, the electrical signal will also be affected, and the quality and reliability of the product will be reduced. For the copper clip package chip products with high thermal conductivity and high electrical conductivity requirements, the impact will be greater, and the problem of air holes needs to be solved urgently; the second is during the reflow soldering process. In the process, the welding material will melt into a liquid state, which cannot provide stable support for the copper clip placed on its upper part. The overall position of the copper clip will be tilted due to gravity, and the height will be uneven. During reflow cooling, the welding of the copper clip will be tilted. The thickness of the welding material between the chip and the chip is uneven, which will lead to uneven electrical output and heat conduction of the copper clip, which will affect the performance of the product and cannot meet the high performance requirements of the product.
Method used
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Embodiment 1
[0037] figure 1 It is a flowchart of a packaging method for a semiconductor device provided in Embodiment 1 of the present application, such as figure 1 As shown, this embodiment provides a packaging method for a semiconductor device, including:
[0038] S101: Provide a lead frame, the lead frame includes a chip seat, a chip pin and a lead pin, the chip pin is connected to the chip seat, and the lead pin is disconnected from the chip seat.
[0039] In this step, the basic lead frame is mainly provided, and the chip based on the lead frame can be mounted on it.
[0040] S102: Solder chips on the chip holder.
[0041] further, as figure 2 shown, figure 2 It is a schematic flowchart of soldering a chip on a chip holder provided in Embodiment 1 of the present application. Step S102 specifically includes:
[0042] S102a: preparing a conductive bonding material on the chip seat;
[0043] S102b: Solder the chip on the conductive bonding material by using the reflow soldering ...
Embodiment 2
[0064] like Figure 4 and 5 shown, Figure 4 is a schematic structural diagram of a semiconductor device provided in the second embodiment of the present application, Figure 5 This is a top view of the copper clip provided in Embodiment 2 of the present application. This embodiment provides a semiconductor device, including:
[0065] Lead frame 1, the lead frame 1 includes a chip 2 seat, a chip 2 pin and a lead pin, the chip 2 pin is connected to the chip 2 seat, and the lead pin is disconnected from the chip 2 seat ;
[0066] Conductive bonding material 4, the conductive bonding material 4 is located on the chip 2 seat;
[0067] The chip 2, the chip 2 is connected to the chip 2 seat through the conductive bonding material 4;
[0068] Copper clip 3, the copper clip 3 includes a first contact part 31, a second contact part 32 and a connecting part 33, the first contact part 31 is connected with the second contact part 32 through the connecting part 33, The wedge-shaped t...
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Abstract
The embodiments of the present application disclose a packaging method of a semiconductor device and a semiconductor device. According to the technical solution provided by the embodiments of the present application, the copper clip is press-fitted with the chip and the lead pins by using a wedge-shaped tool, so that the copper clip is plastically deformed, and finally the copper clip and the chip and the lead pins are formed. The copper-copper bond is formed by diffusion bonding between them, and the above-mentioned pressing method replaces the original method of combining copper clips with chips and lead pins by soldering materials. Since there is no need to perform soldering and solder removal operations when the copper clip is combined with the chip and the lead frame, the actual production capacity of the semiconductor device is improved, and the stability of the packaging process is improved; and the copper clip is directly combined with the surface copper layer of the lead frame. The effect of double-sided heat dissipation can be achieved, and the heat dissipation capability of the semiconductor device can be further improved.
Description
technical field [0001] The embodiments of the present application relate to the technical field of semiconductors, and in particular, to a packaging method of a semiconductor device and a semiconductor device. Background technique [0002] At present, the existing combination of copper clips and chips is mainly carried out by welding, and there are the following problems in the production process: First, in the welding of copper clips, due to the characteristics (large area) of welding materials and copper clips, Since the air cannot escape effectively, a large number of air holes will appear in the welding layer between the copper clip and the chip. The area of the air hole also increases with the increase of the welding area between the copper clip and the chip. The thermal conductivity is reduced, the electrical signal will also be affected, and the quality and reliability of the product will be reduced. For the copper clip packaged chip products with high thermal condu...
Claims
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Application Information
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