Cutting and polishing integrated device for internal pipeline of electronic product
A technology for electronic products and cutting devices, which is applied to other manufacturing equipment/tools, metal processing machinery parts, maintenance and safety accessories, etc. Efficiency, avoid separate work, save the effect of redundant steps
Inactive Publication Date: 2020-10-02
张寰宇
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Problems solved by technology
[0002] There are pipeline structures inside electronic products. These pipeline structures play a vital role in the use of electronic products. Therefore, the processing of internal pipelines in electronic products is particularly important. The processing process generally requires high precision and reliable stability. The internal pipeline of the product generally needs to be cut and polished to move towards the finished product. The cutting process and the grinding process of the internal pipeline of the electronic product are generally carried out separately, and two pieces of equipment are required to process it separately. There are many processing procedures and the steps are relatively complicated. , which seriously affects the production efficiency of electronic products, so we propose a cutting and grinding integrated device for internal pipes of electronic products
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0018] see Figure 1-5 , the present invention provides a technical solution: an integrated cutting and polishing device for internal pipes of electronic products, including a base 1, a cutting device is provided on the upper surface of the base 1, and the electronic product tubes to be cut are placed on the base 1, cutting is carried out by a cutting device, the cutting device includes two fixed plates 2, the fixed plates 2 play the role of support and fixati...
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The invention discloses a cutting and polishing integrated device for an internal pipeline of an electronic product. According to the cutting and polishing integrated device, a cutting device is arranged on the upper end face of a base, the cutting device comprises two fixing plates, the two fixing plates are symmetrically and fixedly connected to the upper end face of the base, a protective box is fixedly connected to the outer surface of the fixing plate on one side, a motor A is fixedly connected to the outer surface of the protection box, a motor shaft is arranged at the output end of themotor A and rotationally penetrates through the protection box, the end, away from the motor A, of the motor shaft is rotationally connected with a fixing plate close to the motor A, a driving gear Ais fixedly connected to the position, in the protection box, of the motor shaft, the cutting device and a grinding device are arranged on the base at the same time, so that cut products can be ground,separate work is avoided, redundant steps are saved, and the production efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of cutting and grinding of internal pipes of electronic products, and specifically relates to an integrated device for cutting and grinding of internal pipes of electronic products. Background technique [0002] There are pipeline structures inside electronic products. These pipeline structures play a vital role in the use of electronic products. Therefore, the processing of internal pipelines in electronic products is particularly important. The processing process generally requires high precision and reliable stability. The internal pipeline of the product generally needs to be cut and polished to move towards the finished product. The cutting process and the grinding process of the internal pipeline of the electronic product are generally carried out separately, and two pieces of equipment are required to process it separately. There are many processing procedures and the steps are relatively complicated. ...
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IPC IPC(8): B23P23/04B23Q11/08
CPCB23P23/04B23Q11/08
Inventor 张寰宇张钰铜张禹熙
Owner 张寰宇