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Flexible temperature equalizing plate

A vapor chamber, flexible technology, used in electrical equipment structural parts, lighting and heating equipment, cooling/ventilation/heating retrofits, etc., can solve problems such as lack of elasticity

Inactive Publication Date: 2020-10-23
泽鸿(广州)电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once made, its shape remains fixed, so it lacks the flexibility to change

Method used

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Examples

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Embodiment Construction

[0037] The following examples are provided to describe the present invention in detail, and the examples are only used as examples for illustration and will not limit the scope of protection of the present invention. In addition, the drawings in the embodiments omit elements that are not necessary or can be completed by common techniques, so as to clearly show the technical characteristics of the present invention.

[0038] The implementation description of the present invention is now carried out with a first embodiment. See also Figure 1A and Figure 1B . in Figure 1A It is a longitudinal sectional view of a vapor chamber 1 proposed in the first embodiment; Figure 1B It is a cross-sectional view of the chamber 1 . Such as Figure 1A and Figure 1B As shown, the vapor chamber 1 mainly includes an upper cover 11 , a lower cover 12 and a working fluid (not shown in the drawing). The upper cover 11 is disposed on the lower cover 12 , and a chamber 100 is formed therebetw...

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Abstract

The invention provides a flexible temperature equalizing plate. The flexible temperature equalizing plate is applied to an electronic device. The temperature equalizing plate comprises an upper cover,a lower cover, a chamber, a capillary structure, a plurality of support units and working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The upper cover is arranged on the lower cover. The chamber is formed between the upper cover and the lower cover. The capillary structure is arranged on the lower cover and is located in the chamber. The support units are arranged on the upper cover and are located in the chamber, and the support units abut against the capillary structure. The working fluid is contained in the chamber. Thetemperature equalizing plate can be flexible in a flexible range, and the flexible temperature equalizing plate can be set according to the shape of the electronic device. Therefore, the flexible temperature equalizing plate can be flexibly set according to the applied electronic device, and the structural strength of a shell can be effectively maintained.

Description

technical field [0001] The invention relates to a cooling device, in particular to a uniform temperature plate. Background technique [0002] With the increasing development of mobile computing technology, people have also widely used various mobile electronic devices, such as notebook computers or smart phones. As the design of such devices becomes thinner and thinner, the internal space thereof becomes smaller, and at the same time, the functions and performances of such devices increase, causing the electronic components inside to generate a large amount of heat during operation. If the heat cannot be effectively dissipated from the narrow internal space, the high temperature will easily cause damage to the electronic components. Therefore, the heat dissipation design of mobile electronic devices has always been an important issue that cannot be ignored. [0003] Generally speaking, the current industry mostly uses materials with good thermal conductivity properties for...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04F28F9/00F28F9/007F28F21/08H05K7/20
CPCF28D15/0275F28D15/046F28F9/001F28F9/0075F28F21/08H05K7/20336
Inventor 陈志伟郭哲玮张天曜庄翔智
Owner 泽鸿(广州)电子科技有限公司
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