Electromagnetic shielding packaging structure and manufacturing method of electromagnetic shielding packaging structure
A technology of electromagnetic shielding and packaging structure, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of reduced shielding performance, disconnection of connection points, small bonding area between grounding wire and metal shielding layer, etc., and achieves electromagnetic shielding performance stable effect
Active Publication Date: 2020-12-15
FOREHOPE ELECTRONICS NINGBO CO LTD
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Problems solved by technology
However, the contact between the grounding wire and the metal shielding layer in the substrate is not firm, and the bonding area between the grounding wire and the metal shielding layer is small. It is easy to cut the product or use the product for a long time only by the connection between the grounding wire and the metal shielding layer. In case of disconnection of the connection point, resulting in a decrease in shielding performance
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[0050] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0051] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
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The embodiment of the invention provides an electromagnetic shielding packaging structure and a manufacturing method of the electromagnetic shielding packaging structure, and relates to the technicalfield of semiconductor packaging. The electromagnetic shielding packaging structure comprises a substrate, a chip, a first plastic package body, a second plastic package body, a substrate pin, a connecting piece and a metal shielding layer, wherein the chip and the first plastic package body are arranged on the same side of the substrate, and the first plastic package body is used for forming a space for accommodating the chip; the substrate pin is arranged on one side, far away from the chip, of the substrate; the second plastic package body is arranged on one side, far away from the chip, ofthe substrate, and is used for forming a space for accommodating the substrate pin and the connecting piece; the metal shielding layer is arranged on the surface of the first plastic package body, the side surface of the substrate and the surface of the second plastic package body; the metal shielding layer is connected with the end, away from the substrate, of the connecting piece; and the end,close to the substrate, of the connecting piece is connected with the substrate pin, so that electromagnetic shielding of the chip is achieved. Through such arrangement, the electromagnetic shieldingpackaging structure stable in electromagnetic shielding performance can be obtained.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an electromagnetic shielding packaging structure and a manufacturing method of the electromagnetic shielding packaging structure. Background technique [0002] Electromagnetic shielding has always been a problem that needs to be paid attention to in the production of semiconductor packaging structures. In the prior art, metal sputtering is generally used to form an electromagnetic shielding layer on the plastic package, and the formed electromagnetic shielding layer is connected to the ground wire in the substrate. Conduction, in order to achieve the purpose of electromagnetic shielding. However, the contact between the grounding wire and the metal shielding layer in the substrate is not firm, and the bonding area between the grounding wire and the metal shielding layer is small. It is easy to cut the product or use the product for a long time only by the connecti...
Claims
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IPC IPC(8): H01L23/31H01L23/60H01L21/56
CPCH01L21/56H01L23/3121H01L23/60H01L2224/48091H01L2224/48227H01L2224/97H01L2924/00014
Inventor 何正鸿钟磊
Owner FOREHOPE ELECTRONICS NINGBO CO LTD