Computer case heat dissipation device capable of offsetting

A technology of cooling device and computer, applied in computing, instruments, electrical and digital data processing, etc., can solve problems such as affecting normal operation, reducing heat dissipation effect, and entering the inside of the chassis, etc.

Inactive Publication Date: 2020-10-27
广州圣希悦贸易有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] As a part of computer accessories, the chassis is mainly used to place and fix various computer accessories, and play a role of support and protection. Since the computer will generate a lot of heat during operation, the chassis also needs to have a good The air outlet of the traditional chassis is always open. When placed for a long time, dust can easily enter the inside of the chassis fro

Method used

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  • Computer case heat dissipation device capable of offsetting
  • Computer case heat dissipation device capable of offsetting
  • Computer case heat dissipation device capable of offsetting

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] Embodiments of the computer case cooling device capable of deflecting are as follows:

[0025] see Figure 1-6 , a computer case heat dissipation device capable of offsetting, comprising a casing 1, an air outlet 2, a cooling cylinder 3, a guide rod 4, a protective cover 5, a first spring 6, a fan 7, a mounting base 8, a sleeve 9, Second spring 10, telescopic rod 11, ball 12, bell mouth 13, rotating disk 14, sealing plate 15, transmission rod 16.

[0...

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PUM

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Abstract

The invention provides a computer case heat dissipation device capable of offsetting, and relates to the technical field of case heat dissipation. The computer case heat dissipation device capable ofoffsetting comprises a shell, an air outlet is fixedly formed in the left side of the shell, a heat dissipation cylinder is fixedly installed at the right end of the shell, guide rods are fixedly installed at the right end of the heat dissipation cylinder, a protective cover is slidably connected between the guide rods, a first spring is fixedly connected to the right end of the protective cover on the periphery of the guide rods, and a fan is rotatably connected into the protective cover. The invention discloses a computer case heat dissipation device capable of offsetting. According to the technical scheme, the fan is enabled to be close to the processor during heat dissipation to improve the heat dissipation effect while peripheral air flow of the processor is ensured in a normal state,the air outlet is automatically opened during heat dissipation and is automatically closed when heat dissipation is stopped, dust is prevented from entering the casing, and normal operation of internal parts is ensured.

Description

technical field [0001] The invention relates to the technical field of chassis heat dissipation, in particular to a computer chassis heat dissipation device capable of offsetting. Background technique [0002] As a part of computer accessories, the chassis is mainly used to place and fix various computer accessories, and play a role of support and protection. Since the computer will generate a lot of heat during operation, the chassis also needs to have a good The air outlet of the traditional chassis is always open. When placed for a long time, dust can easily enter the inside of the chassis from the air outlet, affecting the normal operation of the internal components of the chassis. In order to ensure the normal operation of the processor in the chassis The cooling device inside the chassis will keep a certain distance from the processor, and therefore, when the cooling device is running, the heat dissipation effect will decrease due to the distance between the cooling de...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/182G06F1/20
Inventor 何伯韬
Owner 广州圣希悦贸易有限公司
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