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Buffering device

A buffer device and frame technology, which is applied in the direction of transportation and packaging, to prevent mechanical damage, containers, etc., can solve the problems of many parts of the packaging box, increase the manufacturing cost, and not be environmentally friendly

Inactive Publication Date: 2020-10-30
MINGSHUO COMP (SUZHOU) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, most of the packaging boxes traditionally used to package products are formed by colloidal bonding. However, due to the large number of parts in the packaging box, this method will be time-consuming and laborious.
Furthermore, in the traditional method, the packaging box has been glued and fixed, so it cannot be applied to products of different sizes and the storage space takes up a lot
On the other hand, the method of using colloidal bonding is not environmentally friendly and will greatly increase manufacturing costs

Method used

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Embodiment Construction

[0043] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0044] Figure 1A It is a three-dimensional schematic diagram of a buffer device according to an embodiment of the present invention. Figure 1B for Figure 1A The bottom view of the buffer device before forming. Please refer to Figure 1A as well as Figure 1B , the buffer device 100A of this embodiment includes at least one first frame body 110 and at least one second frame body 120 . The first frame body 110 and the second frame body 120 are integrally formed. A plurality of first joints C1 (two shown in the figure) between the first frame body 110 and the second frame body 120 respectively have a first half tangent line L1, and the first frame body 110 and the second frame body 120 a...

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Abstract

The invention provides a buffering device which comprises at least one first frame body, at least one second frame body and at least two limiting plates. Each second frame body and the corresponding first frame body are integrally formed; a first half tangent line is arranged at a first connection position of each first frame body and the corresponding second frame body; and the first frame bodiesand the second frame bodies are folded inwards along the multiple first half tangent lines to stand on a plane. The limiting plates and the second frame bodies are integrally formed; a second half tangent line is arranged at a second connection position between each limiting plate and the corresponding second frame body; and each limiting plate is folded outwards along the corresponding second half tangent line to stand on the corresponding second frame body.

Description

technical field [0001] The invention relates to a buffer device, and in particular to an integrally formed buffer device. Background technique [0002] Generally speaking, most of the packaging boxes traditionally used to package products are formed by colloidal bonding. However, due to the large number of parts in the packaging box, this method will be time-consuming and laborious. Furthermore, in the traditional method, the packaging box has been glued and fixed, so it cannot be applied to products of different sizes and the storage space takes up a lot. On the other hand, the method of using colloidal bonding is not environmentally friendly, and will greatly increase the manufacturing cost. Contents of the invention [0003] The invention is aimed at an integrally formed buffer device, which does not need to be bonded, and can effectively reduce the forming time and storage space. [0004] A buffer device of the present invention comprises at least one first frame bod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D25/02B65D81/05
CPCB65D25/02B65D81/05
Inventor 张仕旺吕信璋
Owner MINGSHUO COMP (SUZHOU) CO LTD