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A clamping mechanism for flipping electronic components

A technology for electronic components and clamping mechanisms, which is applied in the field of clamping mechanisms for flipping electronic components, can solve problems such as inability to rotate, single function of the clamping mechanism, and dust attached to the surface of electronic components, and achieve reasonable design and high efficiency. Practicality and market prospects, the effect of improving the quality of use

Active Publication Date: 2021-09-21
SUZHOU ZHUOLUO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When assembling electronic components, it is necessary to clamp the electronic components. The existing electronic component clamping mechanism has a single function and cannot be rotated during use. It can only complete a single operation command. When performing multiple command control Multiple devices need to be installed to complete the processing. At the same time, dust will adhere to the surface of electronic components during processing, which will affect the quality of subsequent electronic components. Therefore, in order to solve this problem, it is urgent to develop a more mature electronic component. Component clamping mechanism

Method used

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  • A clamping mechanism for flipping electronic components
  • A clamping mechanism for flipping electronic components
  • A clamping mechanism for flipping electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] see Figure 1~4 , in an embodiment of the present invention, a clamping mechanism for easily flipping electronic components includes a base 1, a central control mechanism 2, a first processing assembly 3 and a second processing assembly 4, and the central control mechanism 2 is installed on In the middle above the base 1, the first processing assembly 3 is arranged on the left side of the bottom of the central control mechanism 2, and the second processing assembly 4 is arranged on the right side of the bottom of the central control mechanism 2, and a clip is installed outside the central control mechanism 2. holding device 5, the first processing assembly 3 is used to clamp electronic components, the second processing assembly 4 is used to place electronic components, and the top of the middle control mechanism 2 is electrically installed for controlling the The PLC logic controller 7 of the clamping device 5 is provided with a wireless transmitting module inside the P...

Embodiment 2

[0024] A first infrared sensor 8 is installed on the left side of the PLC logic controller 7, a second infrared sensor 9 is installed on the right side of the PLC logic controller 7, and the first infrared sensor 8 acts on the first processing assembly 3 , the second infrared sensor 9 acts on the second processing assembly 4, and an infrared emitter 209 is horizontally arranged on the top of the fixed frame 207, and the infrared emitter 209 cooperates with the first infrared sensor 8 and the second infrared sensor 9 In use, when the infrared emitter 209 is aligned with the first infrared sensor 8, the telescopic sleeve 502 drives the clamping plate 508 to descend, and when the limit blocks 507 on the left and right sides are pressed together with the pressure sensor 10, the PLC logic controller 7 controls The electric telescopic clamp rod 510 inside the clamping disc 508 clamps the electronic components on the first conveyor belt 301. After the clamping is completed, the telesc...

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PUM

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Abstract

The invention discloses a clamping mechanism for flipping electronic components, which includes a base, a central control mechanism, a first processing assembly and a second processing assembly. The component is arranged on the left side of the bottom of the central control mechanism, and the second processing component is arranged on the right side of the bottom of the central control mechanism. A clamping device is installed outside the central control mechanism, and an electrical installation is installed on the top of the central control mechanism. There is a PLC logic controller for controlling the clamping device, and a cleaning device is provided inside the central control mechanism. The design of this device is reasonable, and it is equipped with multiple electric rotary lifting structures. With the PLC control device, a single mechanism can It can complete multiple command operations, and there is a cleaning device inside, which can complete the cleaning of electronic components while the clamping device is working, improving the quality of use of electronic components. It has high practicability and market prospects. It is suitable for large Widespread use.

Description

technical field [0001] The invention relates to the manufacturing industry of electronic components, in particular to a clamping mechanism for flipping electronic components. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as hairsprings, hairsprings, etc., common ones include diodes, etc. [0003] When assembling electronic components, it is necessary to clamp the electronic components. The existing electronic component clamping mechanism has a single function and cannot be rotated during use. It can only complete a single operation command. When performing multiple command control Multiple devices need to be installed to complete t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90B65G45/10B65G43/08
CPCB65G47/902B65G47/907B65G45/10B65G43/08B65G2203/044B65G2207/26H05K13/0408H05K13/0413B25J15/02B25J15/0052
Inventor 徐倾城
Owner SUZHOU ZHUOLUO INTELLIGENT TECH CO LTD