A laser drilling equipment
A laser drilling and laser technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of consistent micro-holes, laser processing cannot form the overall width, etc.
Active Publication Date: 2022-07-29
江苏亚威艾欧斯激光科技有限公司
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Problems solved by technology
[0003] However, in recent years, in different fields, fine processing has become more and more important, but laser processing cannot form micropores with uniform width throughout
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[0031] The embodiments of the present invention are described below by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0032] It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification, so as to be understood and read by those who are familiar with the technology, and are not used to limit the implementation of the present invention. Restricted conditions, it does not have technical substantive significance, any structural modification, proportional relationship change or size adjustment, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the present invention. The disclosed technical content must be within the scope of coverage. At the same tim...
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The invention provides a laser drilling equipment, which is provided with a laser lens and a focusing lens placed in the lens barrel in sequence, and the second surface of the laser lens is inclined relative to the first surface, from the first end of the second surface to the The thickness of the second end of the second surface is thickened; the focusing mirror and the laser mirror are placed on the same rotation axis, and the laser beam emitted by the laser mirror is concentrated on the workpiece at a position away from the rotation axis ; The laser lens and the focusing mirror are rotated with the rotation axis as the rotation center by the first rotating device. At the same time, the lens barrel, the focusing mirror and the first rotating device are all mounted on a mounting plate, and the mounting plate is driven by the lifting device along the axis of rotation. The advancing direction of the laser beam moves linearly back and forth relative to the workpiece. The laser drilling equipment of the present invention can process micro-holes with various cross-sectional shapes.
Description
technical field [0001] The invention belongs to the technical field of laser processing equipment, and relates to a laser drilling equipment. Background technique [0002] In the prior art, through holes of printed circuit substrates are usually processed by mechanical drilling, but with the refinement of circuits, the size of the through holes becomes very small, and the mechanical processing of micro holes is limited, so The processing method using laser is adopted. [0003] However, in recent years, fine processing has become more and more important in different fields, but laser processing cannot form microholes with a uniform overall width. SUMMARY OF THE INVENTION [0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a laser drilling device for solving the problem that the cross-sectional shape of the micro-holes in the prior art is fixed. [0005] To achieve the above purpose and other related pur...
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IPC IPC(8): B23K26/382B23K26/082B23K26/064
CPCB23K26/382B23K26/082B23K26/064B23K26/0643
Inventor 凌步军朱鹏程袁明峰吕金鹏赵有伟滕宇孙月飞冷志斌冯高俊
Owner 江苏亚威艾欧斯激光科技有限公司