Supercharge Your Innovation With Domain-Expert AI Agents!

Dummy portion removing unit and dummy portion removing method using dummy portion removing unit

A technology for dummy parts and components, which can be applied to electrical components, glass manufacturing equipment, glass cutting devices, etc., and can solve problems such as residual adhesion state and dummy parts falling to undesired places

Pending Publication Date: 2020-11-03
TOP ENG CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, even if the jig moves so as to be spaced from the end of the substrate in the state where the dummy part is attracted to the suction part, the dummy part may be damaged due to various reasons such as an adhesive between the dummy part and the end part of the substrate or static electricity. The problem that the part is not separated from the end of the substrate but remains in an attached state at the end of the substrate
Therefore, there is a problem that the substrate is transferred to the subsequent process with the dummy portion remaining at the edge of the substrate, or the dummy portion falls to an unintended place during the process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dummy portion removing unit and dummy portion removing method using dummy portion removing unit
  • Dummy portion removing unit and dummy portion removing method using dummy portion removing unit
  • Dummy portion removing unit and dummy portion removing method using dummy portion removing unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Hereinafter, a dummy portion removing unit and a dummy portion removing method using the dummy portion removing unit according to the present invention will be described with reference to the drawings.

[0027] First, a substrate dicing apparatus provided with a dummy portion removing unit according to an embodiment of the present invention will be described. An object to be cut by the substrate cutting device may be a bonded substrate constituted by bonding the first panel and the second panel. For example, the first panel may include thin film transistors, and the second panel may include color filters. On the contrary, the first panel may include color filters, and the second panel may include thin film transistors. In the figure, the first panel is located at the top and the second panel is located at the bottom, but the present invention is not limited to the orientation of the first panel and the second panel.

[0028] Hereinafter, the bonded substrate is simply...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a dummy portion removing unit and a dummy portion removing method using the same, the dummy portion removing unit removing a dummy portion delimited by a scribe line, the scribe line being formed at an end portion of a second panel of a substrate formed by adhering a first panel and the second panel; wherein the dummy portion removing unit may include a dummy portionpressurizing assembly that applies a force in a direction in which the dummy portion is separated from an end portion of the substrate to a side surface of the dummy portion.

Description

technical field [0001] The present invention relates to a dummy portion removing unit and a dummy portion removing method using the dummy portion removing unit, the dummy portion removing unit is provided in a substrate cutting device for cutting a substrate, and the dummy portion removing unit is set from the end of the substrate to form a stepped portion Department to remove dummy department. Background technique [0002] In general, brittle mother glass panels such as glass (hereinafter referred to as A unit glass panel (hereinafter referred to as a "unit substrate") cut into a predetermined size. [0003] The process of cutting the substrate into unit substrates includes moving the scribing wheel and / or the substrate along the cutting plan line of the substrate to be cut while pressing the scribing wheel made of a material such as diamond against the substrate to form a scribe line. Scribing process. [0004] The substrate is formed by bonding the first panel and the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67C03B33/02
CPCH01L21/67092C03B33/02
Inventor 张喜童金善根徐正欢
Owner TOP ENG CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com