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A kind of high thermal insulation board and preparation method thereof

A technology for thermal insulation and substrate, applied in thermal insulation, building thermal insulation materials, construction, etc., can solve the problems of delayed construction period, low splicing efficiency, inability to meet rapid construction, etc. Efficient effect

Active Publication Date: 2021-09-28
江门市鹏美绿家厨卫科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when it is actually used, the existing thermal insulation panels often have complex structures during use, which leads to inconvenient splicing between thermal insulation panels, time-consuming installation and disassembly, and low splicing efficiency. The demand for rapid construction leads to delays in the construction period

Method used

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  • A kind of high thermal insulation board and preparation method thereof
  • A kind of high thermal insulation board and preparation method thereof
  • A kind of high thermal insulation board and preparation method thereof

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] The present invention provides such Figure 1-6 The shown high heat insulation board includes a first base plate 1 and a second base plate 2, one side and two ends of the first base plate 1 are symmetrically connected with a first connecting plate 15, and the two first connecting plates The opposite side of the top of 15 is connected with the first sliding plate 16, and the two ends of the side of the second base plate 2 close to the first base plate 1 are symmetrically provided with first card slots 22, and the two first card slots 22 are respectively Connected with the corresponding first connecting plate 15, the opposite sides of the two first card slots 22 are provided with first sliding grooves 23, and the two first sliding grooves 23...

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Abstract

The invention discloses a high heat insulation board, which comprises a first base plate and a second base plate, a first connecting plate is connected to one side and two ends of the first base plate, and a second connecting plate is connected to one side of the first connecting plate. A slide plate, first slots are opened at both ends of one side of the second substrate, and a first slide slot is opened at one side of the first slot. In the present invention, the first substrate and the second substrate can be preliminarily connected by inserting the second connecting plate and the second sliding plate at the two ends of one side of the protrusion into the second locking groove on the inner wall corresponding to the first groove and the second groove. For the splicing, the first connecting plate and the first slide plate on the side of the first substrate are inserted into the first slot on the side of the second substrate, and the first substrate and the side of the second substrate are closely bonded. The base plate and the second base plate are spliced ​​and installed in the second step to complete the splicing of the first base plate and the second base plate, thereby facilitating splicing installation and disassembly, high splicing efficiency, and meeting the needs of rapid construction.

Description

technical field [0001] The invention relates to the technical field of thermal insulation boards, in particular to a high heat insulation thermal insulation board and a preparation method thereof. Background technique [0002] With the rapid rise of the construction industry, the construction market is also constantly expanding. Roof design is one of the core designs in architecture. The traditional roof has a single function and is no longer applicable to the current environment. Now people The living standards of the people are constantly improving, and the requirements for the living environment are also getting higher and higher. Therefore, architects began to use insulation boards to increase the functionality of the roof. The insulation board is made of polystyrene resin as raw material plus other raw materials and polyester The rigid foam plastic board manufactured by heating and mixing while injecting the catalyst, and then extruded and extruded has moisture-proof an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04B1/80E04B1/94E04B1/64E04B1/61
CPCE04B1/61E04B1/6137E04B1/644E04B1/80E04B1/942E04B2001/6191
Inventor 赵桂英李奕贤王勇龚魏魏王忠光张清宇
Owner 江门市鹏美绿家厨卫科技有限公司
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