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Semiconductor device package

A technology for semiconductors and light-emitting devices, which can be used in semiconductor devices, electrical solid-state devices, electrical components, etc., and can solve problems such as large cost and size

Pending Publication Date: 2020-11-17
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some methods for manufacturing the above-mentioned semiconductor device packages may require relatively large cost and size

Method used

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  • Semiconductor device package
  • Semiconductor device package
  • Semiconductor device package

Examples

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Embodiment Construction

[0014] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below. Of course, these components and arrangements are examples only and are not intended to be limiting. In the present invention, mentioning in the following description that the first feature is formed on or on the second feature may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include that the additional feature may be formed on the first feature. Formed between the second feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself dictate a relationship between the various ...

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Abstract

A semiconductor device package includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipationstructure includes a housing, an optical component disposed on the housing, and a light-emitting device disposed in the housing and capable of emitting light toward the first optical component.

Description

technical field [0001] In particular, the present invention relates to a semiconductor device package and a semiconductor device package with multiple modules. Background technique [0002] A semiconductor device package may include some modules integrated therein, such as an optical module, a power module, and a communication module. Relatively high precision may be required to assemble these modules to ensure the performance of the semiconductor device package. However, some methods for manufacturing the above-mentioned semiconductor device packages may require relatively large costs and sizes. Contents of the invention [0003] According to some example embodiments of the present invention, a semiconductor device package includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipation structure includes a housing, an optical component disposed on the housing, and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/48H01L33/58H01L25/075
CPCH01L25/0753H01L33/48H01L33/58H01L33/64H01L25/167H01L31/0203H01L31/02327H01L31/024H01L31/173H01L33/647H01L33/483H01L33/486H01L33/62H01L33/642H01L33/644
Inventor 陈盈仲
Owner ADVANCED SEMICON ENG INC