PCB (printed circuit board) screening machine

Abstract

The invention discloses a PCB (printed circuit board) screening machine. The PCB screening machine comprises a machine main body, a main body seat, an auxiliary machine seat, a lifting assembly and atransverse moving assembly, wherein a rectangular cavity is formed in the center of the top of the machine main body; the main machine seat is fixedly connected to the front side of the top of the machine main body and located on the front end side of the rectangular cavity; the auxiliary machine seat is fixedly connected to the rear side of the top of the machine main body and located on the rearend side of the rectangular cavity; and the transverse moving assembly comprises a fixed base plate fixedly connected to the inner side wall of the main machine seat, two fixed shafts fixed between the inner side wall of the fixed base plate and the upper part of the inner side wall of the auxiliary machine seat and distributed in a symmetrically parallel manner, two second screw rods rotationally connected between the inner side wall of the fixed base plate and the lower part of the inner side wall of the auxiliary machine seat and aligned with the fixed shaft in parallel as well as a transverse moving base plate which is glidingly nested on the fixed shaft and the second screw rod and is parallel to and symmetric with the fixed base plate. The PCB screening machine can automatically screen out PCBs with thicknesses meeting the standard, does not need manpower for measurement and judgment and can improve the screening efficiency of the PCBs screened according to the thickness standard.

Description

technical field [0001] The invention belongs to the technical field of machinery, and in particular relates to a printed circuit board screening machine. Background technique [0002] After the SMT printing process is completed, the printed circuit board needs to be monitored in multiple processes, such as the appearance inspection of the printed circuit board, the pin closure effect, the welding effect of the parts, the conduction test, etc. The appearance inspection of the printed circuit board is usually performed by multiple processes. A manual process is used to detect various appearance indicators, and the thickness of the printed circuit board is detected by a thickness detector. When the PCB board is not pressed in place or the components are soldered, the laminated PCB will be delaminated, which will lead to The thickness of the PCB board increases, and the PCB board with increased thickness is a bad board, which needs to be removed and repaired. However, in reality...

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Problems solved by technology

[0002] After the SMT printing process is completed, the printed circuit board needs to be monitored in multiple processes, such as the appearance inspection of the printed circuit board, the pin closure effect, the welding effect of the parts, the conduction test, etc. The appearance inspection of the printed circuit board is usually performed by multiple processes. A manual process is used to detect various appearance indicators, and the thickness of the printed circuit board is detected by a thickness detector. When the PCB board is not pressed in place or the components are soldered, the laminated PCB will be delaminated, which will lead to The thickness of the PCB board increases, and the PCB board with increased thickness is a bad board, which needs to be removed and repaired, but in reality, most of them are confirmed manually, and the efficiency is low

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