Method for calculating COG hot-pressing process parameters

Abstract

The invention discloses a method for calculating COG hot-pressing process parameters. The method comprises the steps that a COG pressing value expression is constructed according to the IC thickness,the ACF thickness and the glass thickness of a product, a pressing value actually needing to be set by a COG pressing head is calculated according to the expression, and the calculation formula of thepressing value actually needing to be set by the COG pressing head is shown as follows: S = A-(B-(C + D + E)) + F, wherein S is a pressing value actually required to be set by the COG pressing head,A is a Z-axis reference quantity set in the COG pressing head servo system, B is the actual distance between the lower part of the pressing head and the upper part of a back-supporting platform, C isthe total thickness of the IC including Bump, D is the thickness of the glass, E is the ACF thickness obtained according to the specification, and F is an empirical constant. According to the method for calculating COG hot-pressing process parameters, the ACF curing rate reaches the standard after a Bump region is heated and stressed, and empty Bump regions at two ends are not subjected to the pressure action of the pressing head.

Description

technical field [0001] The present application belongs to the technical field of display screens, and in particular relates to a method for calculating COG hot-pressing process parameters. Background technique [0002] It should be noted that the contents recorded in this section do not represent all prior art. [0003] In the LCD module industry, the COG structure is the most widely used structural design. At present, the LCD module is constantly developing in the direction of higher integration, narrower steps, and lower cost. The driver IC is a key display module component. In order to reduce the manufacturing cost of the IC, some ICs adopt a design with both ends floating, such as Figure 1-Figure 3 As shown, the IC bump is evenly distributed on the bonding surface of the IC, and no bump 201 is distributed at both ends. The length of the indenter tooling for conventional COG hot pressing is generally between 50-70mm, and the length of the IC is between 20-35mm. Since th...

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Problems solved by technology

Since the two ends of the IC are suspended in the air (such as the parts labeled 8 and 9), there are bumps that are crimped on the glass through the ACF during hot pressing, but there are no bumps in the suspended areas at both ends and cannot be crimped on the glass, resulting in weak force on the IC as a whole. Uniform, often breaks at both ends of the IC (the broken position is at the position of label 6 and 7), resulting in unstable products, not only wasting materials, increasing manufacturing costs, but also bringing customer complaints

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