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Method for manufacturing semi-slotted hole of PCB

A technology of PCB board and manufacturing method, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of large board expansion and shrinkage, half-slot hole and half-hole size inconsistency, etc., to ensure accuracy, solve size inconsistency, consistent effect

Active Publication Date: 2020-12-01
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of electronic products, the requirements for half-holes on PCB boards are getting higher and higher. In the existing technology, for the half-slot holes on PCB boards, the general forming method is made by thick gongs and fine gongs. The size of the half-slot hole is inconsistent. For example, a board with multiple pcs in a board is prone to such abnormalities. The main reason is that the large board is affected by factors such as expansion and contraction.

Method used

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Embodiment Construction

[0015] The manufacturing method of the half-slot hole of the PCB board of the present invention will be further described in detail in conjunction with specific embodiments below.

[0016] A non-limiting embodiment of the present invention, a method for manufacturing half-slot holes in a PCB board, the PCB board includes a SET large board, and a plurality of PCS small boards are arranged in the SET large board, and the manufacturing method includes PCB positioning manufacturing and half-slotted gong holes.

[0017] In a non-limiting embodiment of the present invention, the PCB positioning production includes positioning the SET large board and each PCS small board respectively, and completing the PCB positioning production by separately positioning the SET large board and the PCS small board; The PCB positioning production specifically includes: 1. The positioning of the SET large board is by setting a mechanical positioning hole on the edge of the SET large board, and the SET...

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PUM

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Abstract

The invention relates to a method for manufacturing a semi-slotted hole of a PCB. The PCB comprises an SET large board; and a plurality of PCS small boards are arranged in the SET large board. The manufacturing method comprises PCB positioning manufacturing and semi-slotted hole milling manufacturing, the PCB positioning manufacturing comprises the steps that the SET large board is positioned, each PCS small board is positioned, and positioning manufacturing of the PCB is completed in the mode that the SET large board and the PCS small boards are positioned; and after the PCB is positioned, the semi-slotted hole is milled by an optical milling machine to complete the manufacturing of the semi-slotted hole. The manufacturing method of the semi-slotted hole of the PCB has the advantages of solving the technical problem of inconsistent sizes of semi-slotted holes, improving the product yield and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a half-slot hole of a PCB board. Background technique [0002] With the continuous development of electronic products, the requirements for half-holes on PCB boards are getting higher and higher. In the existing technology, for the half-slot holes on PCB boards, the general forming method is made by thick gongs and fine gongs. The size of the half-slot hole is inconsistent. For example, a board with multiple pcs in a board is prone to such abnormalities. The main reason is that the large board is affected by factors such as expansion and contraction. Contents of the invention [0003] To this end, the applicant provides a method for manufacturing PCB half-slot holes that solves the technical problem of inconsistency in the size of the half-slot holes and improves product yield. [0004] In order to achieve the above purpose, the f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044
Inventor 杨铠嘉吴永德邓细辉夏国伟施世坤
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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