Chamber uncovering mechanism

A chamber and lid technology, applied in the field of chamber lid opening mechanism, can solve the problems of pollution particles, deformation damage of sealing ring, large installation position, etc.

Pending Publication Date: 2020-12-15
上海广川科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cover can be stopped in the middle of rotation, but this method of opening the cover requires a large installation position due to the mechanical structure of the gear, and the internal structure is a gear structure. When the cover is opened and closed, the gears wi

Method used

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  • Chamber uncovering mechanism
  • Chamber uncovering mechanism
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Embodiment Construction

[0033] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not inte...

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Abstract

The invention discloses a chamber uncovering mechanism convenient for uncovering in a semiconductor vacuum transmission system. The chamber uncovering mechanism comprises a chamber main body, whereinthe chamber main body is provided with an accommodating chamber and an opening leading into the accommodating chamber; a cover body which can cover the opening, wherein the cover body is rotatably connected with the chamber main body; a gas spring which is provided with a first connecting end and a second connecting end, wherein the first connecting end is rotatably connected with the chamber mainbody, and the second connecting end is rotatably connected with the cover body; the gas spring is in a compressed state when the cover body is located at the covering position and abuts against the cover body upwards.

Description

technical field [0001] The invention relates to the field of semiconductor vacuum transmission systems, in particular to a chamber cover opening mechanism. Background technique [0002] In the semiconductor vacuum transmission system, in order to maintain and debug the vacuum equipment, it is necessary to open the cover to clean the cavity and the inside of the robot, and to move the robot, robot arm or robot end effector. Generally, the vacuum transmission equipment is located between multiple devices, and the peripheral equipment is higher than the vacuum transmission equipment, which limits the operable space. [0003] The diameter of the cover of the vacuum transfer equipment can reach 900 mm, and the weight can reach 30 kg. The cover is heavy and the operable space is small, so it is not suitable for direct disassembly and horizontal movement of the cover. [0004] At present, the lid hinge is usually used for positioning, so that the lid can be rotated and opened arou...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCH01L21/67739H01L21/67772
Inventor 冯琳
Owner 上海广川科技有限公司
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