Semiconductor wafer surface cleaning and safe storage protection box

Abstract

The invention discloses a semiconductor wafer surface cleaning and safe storage protection box, which comprises a box body, wherein a lifting cavity is formed in the box body, a clamping block is arranged between the left wall and the right wall of the lifting cavity in an up-down sliding mode, and a clamping plate cavity with a downward opening is formed in the clamping block. According to the invention, the etched semiconductor wafers are washed, dried and stored, some sweeps exist in gaps of the etched wafers, due to the fact that the sweeps are small and difficult to remove, after the etched wafers are clamped by the device, cleaning liquid is sprayed, the sweeps in the gaps fall off by rotating the wafers and turning over the wafers, a drying device blows off the sweeps and dries thewafers, the processed wafers are stored in storage cavities respectively, and a damping device in the storage box can reduce vibration generated by movement of the device, so that the storage environment of the wafers is stable, and the wafers are prevented from being damaged by vibration.

Description

technical field [0001] The invention relates to the semiconductor field, in particular to a semiconductor wafer surface cleaning and safe storage protection box. Background technique [0002] After the semiconductor wafer is etched, there will be scraps remaining in the gaps in the circuit. Using a traditional brush will damage the circuit on the surface of the wafer. Moreover, the wafer is relatively thin and difficult to pick up by hand. Excessive force will damage the wafer. Cause losses, the wafer needs to be stored, transported and transported after the etching is completed. The vibration generated by the general storage device during the operation will cause the wafer to shake, causing damage to the wafer and affecting the quality of the wafer. In severe cases, it may cause relatively large losses. A semiconductor wafer surface cleaning and safe storage protection box described in the present invention can solve the above problems. Contents of the invention [0003...

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Problems solved by technology

[0002] After the semiconductor wafer is etched, there will be scraps remaining in the gaps in the circuit. Using a traditional brush will damage the circuit on the surface of the wafer. Moreover, the wafer is relatively thin and difficult to pick up by hand. Excessive force will damage the wafer. Cause losses, the wafer needs to be stored, transported and transported after the etching is completed. The vibration generated by the general storage device during the operation will cause the wafer to shake, causing damage to the wafer and affecting the quality of the wafer. In severe cases, it may cause relatively large losses

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