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Link design capable of realizing high-speed signal transmission and low loss

A transmission line and signal line technology, applied in the radio frequency field, can solve problems such as the deterioration of high-speed signal transmission, and achieve the effects of unique design, simple production, and cost reduction

Inactive Publication Date: 2020-12-25
北京安石科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a link design that can realize high-speed signal transmission and low loss, can effectively realize high-speed transmission up to 50Gbps, and overcome the problem of high-speed signal transmission deterioration

Method used

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  • Link design capable of realizing high-speed signal transmission and low loss
  • Link design capable of realizing high-speed signal transmission and low loss
  • Link design capable of realizing high-speed signal transmission and low loss

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Embodiment Construction

[0026] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0027] like Figure 5 As shown, on the ceramic substrate transmission provided by the embodiment of the present invention, a metal block 52 is designed to protrude into the interior of the ceramic substrate near the bottom edge of the transmission line 51 . The bottom of the metal block 52 is flush with the bottom of the signal line. The width of the metal block 52 is 20-30% of the width of the signal line. In addition, the length of the metal block 52 is in the range of 200-300um.

[0028] Since the transmission lines 51 are arranged along both sides of the ceramic substrate, typically, metal blocks are arranged inside the transmission lines 51 on both sides.

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Abstract

The invention provides a link design capable of realizing high-speed signal transmission and low loss. The design comprises a metal block which is arranged at the bottom of a ceramic substrate transmission line for welding pins and protrudes towards the interior of the ceramic substrate. According to the link design capable of realizing high-speed signal transmission and low loss provided by the invention, high-speed transmission as high as 50Gbps can be effectively realized, and the problem of deterioration of high-speed signal transmission is solved.

Description

technical field [0001] The invention relates to the field of radio frequency technology, in particular to a link design capable of realizing high-speed signal transmission and low loss. Background technique [0002] Driven by the current demand for 5G wireless fronthaul of the fifth-generation communication network and ultra-large broadband data centers, the speed requirements for its core component optical transceiver modules are getting higher and higher. In terms of 5G wireless fronthaul, 25Gbps optical modules have become the mainstream, and the market demand is huge. In addition, high-speed optical modules are more widely used in data centers. [0003] Commonly used packaging forms for optical devices include TO packaging and Box packaging. TO package (such as figure 1 ) has a simple process and low cost, and was the mainstream packaging form of optical modules in the past, but it cannot be applied in high-speed and ultra-high-speed optical modules. Box packaging ad...

Claims

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Application Information

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IPC IPC(8): H04B10/40H04B10/25
CPCH04B10/40
Inventor 刘青山
Owner 北京安石科技有限公司
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