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Pen point bonding device for bucket pen processing

A pen tip and bonding technology, which is applied in the field of pen tip bonding devices for bucket pen processing, can solve the problems of cumbersome operation process, labor-intensive, low work efficiency, etc., and achieve the effects of simple operation, improved work efficiency and good bonding effect.

Active Publication Date: 2020-12-29
朱存
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the above-mentioned method, such as cumbersome operation process, low work efficiency, and relatively labor-intensive operation, the technical problem to be solved by the present invention is to provide a bucket that is easy to operate, can improve work efficiency, and saves manpower. Pen tip bonding device for pen processing

Method used

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  • Pen point bonding device for bucket pen processing
  • Pen point bonding device for bucket pen processing
  • Pen point bonding device for bucket pen processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026]A pen tip bonding device for bucket pen processing, such asFigure 1-5As shown, it includes a support base 1, a first guide rail 2, a sliding frame 3, and a placement plate 4. The top left and right sides of the support base 1 are connected to the first guide rails 2, and the top of the support base 1 is slidably connected with a sliding frame 3, which supports The top rear side of the seat 1 is slidably connected with a placement plate 4, and also includes a clamping assembly 5 and a moving assembly 6. A moving assembly 6 is provided between the sliding frame 3 and the first guide rail 2, and between the first guide rails 2 on both sides There are clamping components 5.

[0027]The clamping assembly 5 includes a sliding plate 51, a first cylinder 52, a transmission gear 53, a clamping frame 54, a first straight rack 55, a second straight rack 56, a second compression spring 58 and a first compression spring 57, two A sliding plate 51 is slidably connected between the side first g...

Embodiment 2

[0031]On the basis of Example 1, such asimage 3 As shown, it also includes a rotating assembly 7. The rotating assembly 7 includes a ring gear 71, a rotating shaft 72, a drive gear 73, a bevel gear 74, a cylindrical gear 75, and a drive rack 76. The outer arc of the ring 691 is connected with the ring gear 71 , The right sliding plate 68 is rotatably connected with a rotating shaft 72, the rotating shaft 72 is connected with a drive gear 73, the drive gear 73 meshes with the ring gear 71, the top of the right shaft 692 is rotatably connected with a cylindrical gear 75, the cylindrical gear 75 A bevel gear 74 is connected to the top of the transmission shaft and the rotating shaft 72. The two bevel gears 74 mesh with each other. A drive rack 76 is connected to the middle of the first guide rail 2 on the right side. The drive rack 76 meshes with the cylindrical gear 75.

[0032]The sliding plate 68 and the shaft 692 drive all the devices on them to move together when they move. When the ...

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PUM

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Abstract

The invention relates to a bonding device, in particular to a pen point bonding device for bucket pen processing. The technical problem to be solved by the invention is how to design the pen point bonding device for bucket pen processing, which is simple to operate and capable of improving the working efficiency and saving manpower. In order to solve the technical problem, the invention provides the pen point bonding device for bucket pen processing, which comprises a supporting base, a sliding frame, a placing plate, a clamping assembly and a moving assembly. First guide rails are connected to two sides of the top of the supporting base; the sliding frame is connected to the top of the supporting base in a sliding manner; the placing plate is connected to one side of the top of the supporting base in a sliding manner; the clamping assembly is arranged between the sliding frame and the first guide rails; and the moving assembly is arranged between the first guide rails on two sides. Compared with the prior art, the pen point bonding device for bucket pen processing provided by the invention has the beneficial effects that a bucket pen point and a bucket pen holder are bonded together through the cooperative operation of the clamping assembly and the moving assembly, so that the effect of manufacturing a bucket pen is achieved.

Description

Technical field[0001]The invention relates to a bonding device, in particular to a pen tip bonding device for pen processing.Background technique[0002]The brush is a traditional Chinese writing tool, and it can also be used as a painting tool. The brush is a treasure provided by the Chinese nation to the world's art treasure house. The brush is a type of brush. The brush is larger than the normal brush. The pen tip is installed in a bucket-shaped pen barrel, also known as a bucket pen barrel. When making a bucket pen, the bucket pen tip must be inserted into the bucket pen barrel before it can be used.[0003]At present, the method of making a bucket pen is usually by manually dipping the bucket pen head with glue, and then the user inserts the bucket pen head into the bucket pen shaft to complete the production of the bucket pen. The operation process of the above method is cumbersome and the work efficiency is low. The operation is more labor intensive.[0004]Therefore, it is necessa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B43K15/00
CPCB43K15/00
Inventor 朱存
Owner 朱存