Unlock instant, AI-driven research and patent intelligence for your innovation.

Uncovering mechanism for semiconductor device and semiconductor equipment

A semiconductor and main body technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as easy damage to the upper cover or the main body of the device

Pending Publication Date: 2020-12-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The semiconductor device needs to be opened for maintenance after being used for a period of time, and the upper cover or the main body of the device is easily damaged during the traditional flipping and opening process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Uncovering mechanism for semiconductor device and semiconductor equipment
  • Uncovering mechanism for semiconductor device and semiconductor equipment
  • Uncovering mechanism for semiconductor device and semiconductor equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0027] An embodiment of the present application provides an opening mechanism for a semiconductor device, such as figure 1 As shown, the semiconductor device to which the cover opening mechanism is applied may include a device main body 1 and an upper cover 2, and the cover opening mechanism and the semiconductor device together constitute a semicondu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides an uncovering mechanism for a semiconductor device and semiconductor equipment, the uncovering mechanism comprises a lifting assembly and a turnover assembly,the turnover assembly is rotatably connected with an upper cover of the semiconductor device, and the lifting assembly is fixed with a device main body of the semiconductor device. The lifting assembly can drive the turnover assembly to drive the upper cover of the semiconductor device to move in the vertical direction and enable the upper cover of the semiconductor device to be completely separated from the device body of the semiconductor device. According to the uncovering mechanism for the semiconductor device and the semiconductor equipment provided by the embodiment of the invention, damage possibly caused to the upper cover or the device main body of the semiconductor device in the process of opening the upper cover can be effectively avoided.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a cover-opening mechanism for semiconductor devices and semiconductor equipment. Background technique [0002] During the semiconductor process such as etching process, it is necessary to use a semiconductor device with strict airtightness. In order to increase the airtightness of the semiconductor device, the upper cover of the semiconductor device and the main body of the device often need to be tightly bonded. [0003] The semiconductor device needs to be opened for maintenance after being used for a period of time, and the upper cover or the main body of the device is easily damaged during the traditional flip-opening process. Contents of the invention [0004] Embodiments of the present application provide a cover-opening mechanism for a semiconductor device and semiconductor equipment to solve the above problems. [0005] The embodiment of the application adopts the followi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67
CPCH01L21/67063
Inventor 马建强安兆鹏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD