Method for improving recession of large blind hole

A blind hole and laser drilling technology, which is applied in the direction of plating, coating, electrical components, etc. of superimposed layers, can solve the problems of increased difficulty in line etching, too thin copper layer, and pull-off of blind holes, etc., to achieve improved The effect of producing product quality, ensuring the uniformity of copper thickness, and reducing the height of surface copper

CN112165770AInactive Publication Date: 2021-01-01VICTORY GIANT TECH HUIZHOU CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-01-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for improving the recession of a large blind hole, which is used for filling the large blind hole with the blind hole diameter of more than or equal to 5mil and morethan or equal to 10mil on an inner layer anylayer, and comprises the following steps of: filling and leveling up the drilled large blind hole by adopting a whole plate electroplating mode after laserdrilling and chemical copper deposition; and then polishing and grinding the copper surface at the large blind hole in a manner of outer-layer patterning, copper reduction and plate grinding in sequence to improve the recession of the large blind hole. According to the method for improving the large blind hole recession, the flatness of the blind hole reaches 95% or above by optimizing an existingblind hole filling process, the large blind hole recession is greatly improved, the product quality is improved, meanwhile, the procedures of carrying, reworking and the like are omitted, the productquality is improved, and the production cost is effectively reduced.
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Description

technical field

[0001] The invention relates to the technical field of circuit board production, in particular to a method for improving the depression of large blind holes. Background technique

[0002] With the development of electronic information, customers have higher and higher requirements for products. In the process of making anylayer, the blind holes in the inner layer often need to be filled to ensure the diameter of the blind hole laser drilled in the second outer layer plating process and the subsequent hole filling. quality.

[0003] For traditional blind holes (diameter 2.5-5mil, hole depth AR≤1:1), the whole board can be filled and leveled at one time by filling and plating. The inner layer contains large blind holes (10mil≥blind hole diameter≥5mil). Because the hole diameter is too large, it is made by traditional whole board electroplating. Increased the difficulty of laser drilling of blind holes in the sub-outer layer or outer layer conduction position ...

Examples

Embodiment Construction

[0032] The method for improving the depression of large blind holes of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.

[0033] refer to figure 2 and image 3 , a non-limiting embodiment of the present invention, a method for improving the depression of large blind holes, the method is used for the filling of large blind holes with a blind hole diameter of anylayer in the inner layer ≥ 5mil, and the method is laser drilling and After electroless copper plating, the drilled big blind holes are filled and leveled by the whole board electroplating method, and then the copper surface at the big blind holes is polished and smoothed by the method of outer layer graphics, copper reduction + grinding plate in order to improve the big blind holes. method of hole depression. Specifically, the following steps are included,

[0034] S1: Electroless copper deposition. Before the electroless copper depos...