An electroplating device for circuit board production

Abstract

The invention relates to the technical field of electroplating, and discloses an electroplating device for circuit board production, including an electroplating tank, a transmission mechanism, a conveying line, telescopic equipment and a clamping mechanism, the transmission mechanism is arranged on the electroplating tank, and the conveying line is arranged on the transmission mechanism Above, telescopic equipment is set on the conveying line. The clamping mechanism is set on the transmission shaft of the telescopic equipment. The clamping mechanism includes a top plate, a side plate, a rotating shaft and a clamp ring. The top surface of the top plate is fixedly connected with the transmission shaft of the telescopic equipment. The top plate The bottom surface is provided with a chute, the number of side plates is two and both of them are socketed with the chute, and the corresponding surfaces of the two side plates are provided with a through groove A and a movable groove, and a hole is opened on the back of the movable groove and the rotating shaft is socketed in the hole , the front end of the rotating shaft is fixedly connected with a clamp ring. Through the setting of the clamping mechanism, the clamping process of the circuit board before electroplating can be carried out from a low position, which solves the problem that the height of the staff must be affected by the high installation position of the fixture in the existing electroplating device. Certainly asked questions.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device for circuit board production. Background technique [0002] After the circuit board is manufactured, in order to protect the thin chemical copper just deposited on the circuit board and prevent the chemical copper from being oxidized and etched by acid, it needs to be added to a certain extent by electroplating. [0003] The existing patent No. CN109898127A proposes an electroplating device for circuit board production, which has the advantage of increasing the adaptability to electroplating of circuit boards of different sizes, but it needs to fix the top of the circuit board with the fixture when it is fixed. This high position fixing method has certain requirements on the height of employees, which affects the factory's work allocation to employees. [0004] The existing patent number CN102080253B proposes an electroplating fixture and a printe...

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Problems solved by technology

[0003] The existing patent No. CN109898127A proposes an electroplating device for circuit board production, which has the advantage of increasing the adaptability to electroplating of circuit boards of different sizes, but it needs to fix the top of the circuit board with the fixture when it is fixed. This high position fixing method has certain requirements on the height of employees, which affects the factory's work allocation to employees

[0004] The existing patent number CN102080253B proposes an electroplating fixture and a printed circuit board electroplating system, which has the advantages of protecting the flatness and integrity of the thin circuit board after electroplating and the uniformity of the metal layer after electroplating, but it lacks the protection of the circuit board. The cleaning mechanism causes the dust on the circuit board to easily accumulate in the electroplating tank and is difficult to clean up

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