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Sustrate treatment apparatus and method

A substrate processing device and substrate technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as substrate induction electrification

Pending Publication Date: 2021-01-08
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, in the process container, frictional electrification may occur due to the working liquid in the process of recovering the working liquid supplied to the substrate, and because of this, induction electrification may occur on the substrate

Method used

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  • Sustrate treatment apparatus and method
  • Sustrate treatment apparatus and method
  • Sustrate treatment apparatus and method

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Embodiment Construction

[0031] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For reference, in the drawings referred to for explaining the embodiments of the present invention, the dimensions of constituent elements, the thickness of lines, and the like may be somewhat exaggerated in order to facilitate understanding. In addition, the terms used in the description of the embodiments of the present invention are mainly defined in consideration of the functions in the present invention, and may be different according to users, operators' intentions, practices, and the like. Therefore, regarding terms, it should be interpreted based on the contents throughout the entire specification.

[0032] figure 1 It is a cross-sectional view schematically showing the structure of the substrate processing apparatus according to the first embodiment of the present invention.

[0033] refer to figure 1 , The substrate processing apparatus...

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Abstract

The invention relates to a sustrate treatment apparatus and method. Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive memberis made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.

Description

technical field [0001] Embodiments of the present invention relate to a substrate processing apparatus for performing liquid processing on a substrate and a substrate processing method using the same. Background technique [0002] Generally, in the manufacture of semiconductors or displays, an apparatus that supplies a working liquid onto a substrate such as a semiconductor wafer or glass to perform liquid processing is used. As an example of such an apparatus, there is a substrate cleaning apparatus for removing contaminants adhering to a substrate, and the like. [0003] A substrate cleaning apparatus, which is one type of substrate processing apparatus, is configured such that a liquid supply unit supplies a working liquid to a substrate supported by a substrate support unit, and the working liquid supplied to the substrate is recovered by a processing container. Of course, the substrate supporting unit is accommodated in the processing container. [0004] On the other ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H05K9/00H01L21/02
CPCH01L21/67051H01L21/02057H05K9/0067H01L21/6875H01L21/68728H01L21/6704H01L21/67126H01L21/6715B05C11/08G03F7/162H01L21/02282
Inventor 金度延吴世勋金源根李周美黄浩钟许弼覠尹铉李忠现朴炫九
Owner SEMES CO LTD
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