Cleaning device applied to production of chip wafers

A technology for cleaning devices and wafers, which is applied to cleaning methods using liquids, cleaning methods and utensils, static electricity and other directions, which can solve the problems of large size limitations of chips, insufficient fixation, and separation from metal stencils, etc., to improve the cleaning work. Efficiency, the effect of preventing damage to the chip

Pending Publication Date: 2021-01-12
复汉海志(江苏)科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the chip production process, it is necessary to clean the wafer on the surface of the chip, which requires the use of a chip wafer cleaning device. When the existing patents CN209663875U and CN211160813U wafer cleaning devices are in use, there are certain disadvantages. First of all , the existing wafer cleaning device has a relatively simple structure for fixing the chip on the metal stencil, and the fixation is not tight enough, resulting in the phenomenon of detaching from the metal stencil during the cleaning process, and the size of the cleaned chip is limited. Secondly, when the existing chip wafer cleaning device is in use, in order to consider the influence of the static electricity existing inside the main body of the device on the chip, we propose a cleaning device for chip wafer production

Method used

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  • Cleaning device applied to production of chip wafers
  • Cleaning device applied to production of chip wafers
  • Cleaning device applied to production of chip wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] like figure 1 , 2 As shown in . and 3, a cleaning device for chip wafer production includes a device main body 1, an air pump 2 is arranged on the outer surface of the side end of the device main body 1, and a water pump 3 is arranged on the side end of the air pump 2. The model of the water pump 3 is WQ, the outer surface of the side end of the water pump 3 is provided with a cleaning liquid tank 4, the outer surface of the upper end of the device main body 1 is provided with a cover plate 9, the connection between the device main body 1 and the cover plate 9 is provided with a hinge 5, and the front end of the cover plate 9 The outer surface is provided with a handle 8, the upper outer surface of the cover plate 9 is embedded with a control panel 10, the side end of the control panel 10 is provided with a No. 1 groove 6, the upper end of the No. 1 groove 6 is provided with a limit frame 7, and the The lower end is fixedly installed with a fixed plate, and the side en...

Embodiment 2

[0027] On the basis of Example 1, as figure 1 , 4 , 5, the number of motors 13 is two groups, and they are symmetrically arranged. The lower end of the motor 13 is fixedly equipped with a fixed plate, the fixed plate is embedded in the inner side of the partition plate 14 and the device main body 1, and the inner side of the metal mesh plate 15 is fixed. A connecting shaft is installed, the left and right ends of the connecting shaft run through the partition 14, and are fixedly embedded in the inner side of the motor 13, and the upper end of the air intake plate 11 is provided with several air holes, which are arranged in a rectangular array and arranged symmetrically The motor 13 can drive the metal mesh plate 15 to rotate through the connecting shaft. The metal mesh plate 15 drives the chip wafer in the cleaning liquid to rotate and clean, so as to improve the cleaning efficiency. The upper end of the metal mesh plate 15 is provided with a fixed rod 16, and the fixed rod T...

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Abstract

The invention discloses a cleaning device applied to production of chip wafers comprises a device body, wherein an air pump is arranged on the outer surface of the side end of the device body, a waterpump is arranged at the side end of the air pump, a cleaning liquid tank is arranged on the outer surface of the side end of the water pump, a cover plate is arranged on the outer surface of the upper end of the device body, a hinge is arranged at the joint of the device body and the cover plate, and a handle is arranged on the outer surface of the front end of the cover plate. According to the cleaning device applied to production of the chip wafers, through cooperation of a fixing rod, telescopic rods and clamps, the upper ends of the telescopic rods can be adjusted according to the size ofa chip, the chip can be stably fixed to a metal screen plate through cooperation of the crossed fixing rod and the clamps, and the limitation of the device body is reduced; and through cooperation ofa sealing plate, a second groove and an ionic wind bar, static electricity in the device body can be removed before the device body operates, and the chip is prevented from being damaged by the static electricity.

Description

technical field [0001] The invention relates to the field of chip wafer cleaning, in particular to a cleaning device for chip wafer production. Background technique [0002] In the chip production process, it is necessary to clean the wafer on the surface of the chip, which requires the use of a chip wafer cleaning device. When the existing patents CN209663875U and CN211160813U wafer cleaning devices are in use, there are certain disadvantages. First of all , the existing wafer cleaning device has a relatively simple structure for fixing the chip on the metal stencil, and the fixation is not tight enough, resulting in the phenomenon of detaching from the metal stencil during the cleaning process, and the size of the cleaned chip is limited. Secondly, when the existing chip wafer cleaning device is used, in order to consider the influence of static electricity existing inside the main body of the device on the chip, we propose a cleaning device for chip wafer production. Co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/10B08B3/12B08B13/00H01L21/67H05F3/04
CPCB08B3/10B08B3/123B08B13/00H01L21/67023H01L21/67028H05F3/04
Inventor 任晓伟
Owner 复汉海志(江苏)科技有限公司
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