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Cleaning device, wafer processing device and cleaning method of wafer carrying table

A technology for cleaning devices and processing equipment, which is applied in the direction of cleaning methods using gas flow, cleaning methods and utensils, chemical instruments and methods, etc., which can solve problems such as inability to guarantee cleaning strength, and achieve the effect of ensuring cleaning effects

Pending Publication Date: 2021-01-15
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using this method to remove particulate impurities on the surface of the electrostatic chuck, since the surface of the electrostatic chuck is provided with grooves of different shapes, it is difficult to absorb the particulate impurities in the grooves, and the cleaning power cannot be guaranteed.

Method used

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  • Cleaning device, wafer processing device and cleaning method of wafer carrying table
  • Cleaning device, wafer processing device and cleaning method of wafer carrying table
  • Cleaning device, wafer processing device and cleaning method of wafer carrying table

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Embodiment Construction

[0026] A cleaning device, a wafer processing equipment, and a cleaning method for a wafer carrier proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] see Figure 1 to Figure 3 ,in figure 1 It is a structural schematic diagram of a cleaning device in a specific embodiment of the present invention, figure 2 It is a schematic diagram of the cleaning device cleaning the wafer stage in a specific embodiment of the present invention, image 3 It is a schematic diagram of the cleaning device cleaning the wafer stage in a specific embodiment of the present invention.

[0028] In this specific embodiment, a cleaning device 100 is provided with a built-in gas chamber 105 for storing cleaning gas, and the surface of the cleaning device 100 is provided with air holes 101 communicating with the gas chamber 105 for supplying The clean gas stored in the gas chamber 105 is ejected, and t...

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PUM

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Abstract

The invention relates to a cleaning device, a wafer processing device and a cleaning method of a wafer carrying table. The cleaning device is internally provided with a gas cavity used for storing cleaning gas, the surface of the cleaning device is provided with gas holes, and the cleaning device is communicated with the gas cavity and used for spraying out the cleaning gas stored in the gas cavity; and the gas holes are provided with switches used for being opened when the pressure difference between the air cavity and the outside is larger than a first preset threshold value. The cleaning device, the wafer processing device and the cleaning method of the wafer carrying table are provided with the gas cavity, the gas holes and the switches, and are opened only when the pressure differencebetween the gas cavity and the outside is greater than the first preset threshold value, so that it is guaranteed that the cleaning device has certain cleaning strength when spraying out the cleaninggas, and therefore the cleaning effect is ensured.

Description

technical field [0001] The invention relates to the field of semiconductor production, in particular to a cleaning device, wafer processing equipment and a cleaning method for a wafer carrier. Background technique [0002] In the process of wafer production and processing, particles and impurities are often attached to the wafer stage (Wafer stage), which affects the yield of wafer production and processing, and the use of error data monitoring control (FDC, Fault detection control) or statistical process When the statistical process control (SPC, statistical process control) monitors the wafer processing process, the acquisition of monitoring data will also increase the risk of wafer loss or wafer electrical test failure, resulting in product scrapping. [0003] In the prior art, the wafer stage usually refers to an electrostatic chuck (E-chuck). When there are contaminating particles on the surface of the electrostatic chuck, the yield rate of the wafer (wafer) will decre...

Claims

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Application Information

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IPC IPC(8): B08B5/02B08B13/00
CPCB08B5/02B08B13/00
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC