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A 5gcpe

A circuit board, heat sink technology, applied in 5GCPE. It can solve the problems of poor user experience, high product surface temperature, and inability to solve the problem of heat generation in the internal space of CPE, so as to improve the heat dissipation effect and improve the heat dissipation efficiency.

Active Publication Date: 2021-03-12
江苏柏通通信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the heat dissipation methods of CPE mainly include CPU patch and metal shell heat dissipation. Both of these two methods have defects. It will lead to high temperature on the surface of the product and poor user experience

Method used

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  • A 5gcpe
  • A 5gcpe
  • A 5gcpe

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0042] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordi...

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Abstract

The invention relates to the technical field of routers, in particular to a 5GCPE, comprising: a base; a circuit board, which is vertically fixed on the base, and an interface component is fixed on the circuit board; a heat sink mechanism, which is vertically fixed on the side surface of the circuit board; an internal bracket mechanism It is arranged on one side of the heat sink mechanism, and its bottom is fixedly connected with the base and with the circuit board; the main body shell is sleeved on the internal bracket mechanism, and the bottom of the main body shell and the base connect the circuit board, the heat sink mechanism and the circuit board. The internal support mechanism is fixed inside; wherein, the internal support mechanism is provided with a heat dissipation window, the heat dissipation window is communicated and arranged toward the heat dissipation fin mechanism, and the main body shell is provided with a plurality of heat dissipation holes. The invention improves the heat dissipation efficiency of the circuit board by arranging the heat sink mechanism on the circuit board, and forms an effective heat dissipation path through the heat dissipation window set on the internal bracket mechanism and the heat dissipation hole set on the main shell, which is in contrast to the prior art. Compared with 5GCPE, the heat dissipation effect of 5GCPE is improved.

Description

technical field [0001] The present invention relates to the technical field of routers, in particular to a 5GCPE. Background technique [0002] CPE, the full English name is Customer Premise Equipment, and it is called customer terminal equipment in the industry. It converts the received operator network signal into a Wi-Fi signal and provides it to the equipment around it. As the name suggests, 5GCPE is a CPE that supports 5G networks, which can receive 5G network signals and build a Wi-Fi network. Because 5GCPE has stronger antenna gain and higher power, its signal sending and receiving capabilities are stronger than mobile phones. With the application of 5G technology more and more widely, the requirements for CPE are getting higher and higher, especially the heat dissipation effect of CPE. [0003] In the prior art, the heat dissipation methods of CPE mainly include CPU patch and metal shell heat dissipation. Both of these two methods have defects. It will lead to high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04Q1/08H04Q1/02H05K7/20
CPCH04Q1/035H04Q1/08H05K7/2039
Inventor 朱迁虎刘兵时登登郭昌春
Owner 江苏柏通通信科技有限公司