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Environmentally protected sensing device

A kind of equipment and sensor technology, applied in the direction of instruments, fluid velocity measurement, microstructure devices, etc., can solve the problems of affecting electronic equipment, electronic equipment is easy to damage, etc.

Pending Publication Date: 2021-01-22
INVENSENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, filling the encapsulation cavity with gel may affect the performance of the electronics (e.g., sensors) by adding more mass and making the electronics vulnerable to damage during installation

Method used

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  • Environmentally protected sensing device
  • Environmentally protected sensing device
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Examples

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Embodiment Construction

[0021] Before various embodiments are described in more detail, it is to be understood by those of ordinary skill in the art that the embodiments are not limiting since elements may vary in the embodiments. It should also be understood that the particular embodiments described and / or shown herein have elements that can be readily separated from the particular embodiment and that can optionally be combined with any of several other embodiments or substituted for those described herein. any one of the several other embodiments described above.

[0022] Those of ordinary skill in the art should also understand that the terminology used herein is for the purpose of describing certain concepts of the invention and is not intended to be limiting. Unless otherwise stated, ordinal numbers (eg, first, second, third, etc.) are used to distinguish or identify different elements or steps within a set of elements or steps, and do not provide an order of the elements or steps of their embod...

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Abstract

A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.

Description

[0001] related application [0002] This application is a non-provisional patent application and claims the benefit and priority of U.S. Provisional Application No. 62 / 655,047, filed April 9, 2018, which is incorporated herein by reference in its entirety. Background technique [0003] Many electronic devices are used under various conditions and exposed to different external environments. For example, many electronic devices (eg, sensors) may be exposed to the external environment (eg, water, gas, etc.), which may damage the sensing device. Typically, the encapsulation chamber of the electronic device is increased and filled with gel. The gel protects electronics from damage. Unfortunately, adding the package chamber to fill it with gel increases the package size, which drives up the cost. Furthermore, increasing package size works against the goal of miniaturizing electronic devices for smaller footprints and form factors. [0004] Filling the encapsulation cavity with g...

Claims

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Application Information

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IPC IPC(8): B81B7/00
CPCB81B7/0025B81B7/0061H01L2224/8592H01L23/04H01L24/09H01L24/17H01L24/33H01L2224/73265H01L24/73H01L25/18H01L2224/73204H01L24/49
Inventor C·米克劳斯
Owner INVENSENSE