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A manufacturing method of a single mini led integrating RGB three-color light

A manufacturing method and technology of three-color light, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as poor yield control, damaged chips, and easily affected

Active Publication Date: 2022-08-05
罗化芯显示科技开发(江苏)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This requires three massive transfers, and at the same time, requires higher precision and more complex equipment
[0004] 2. When it is necessary to repair a certain chip in the three-in-one lamp bead, it is relatively difficult, and it is easy to affect and damage the nearby chips
[0006] 1. Cross-border process, inconvenient to control
[0007] 2. It is impossible to bin a single test, and the yield control is poor

Method used

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  • A manufacturing method of a single mini led integrating RGB three-color light
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  • A manufacturing method of a single mini led integrating RGB three-color light

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Embodiment Construction

[0021] In response to these shortcomings, the invention aims to complete the integration of RGB three -color chips on the chip side. Save the steps of the three -color mini chip separately. Then cut it directly to get the RGB triple and one lamp bead. It can be used as a improvement of the second method mentioned above. The invention especially studies the wiring structure of positive and negative electrode circuits and the influence of the depth of the dam groove on the luminous structure.

[0022] The present invention can be completed in the chip segment, without the need to cross the industrial segment. At the same time, it can be tested and the loss can be tested. Moreover, it is convenient for patch, no need to transfer multiple times.

[0023] In order to make the purpose, technical solution and advantages of this public embodiment, the following examples of this public embodiment will be combined to clearly and complete the technical solutions of this public embodiment. Ob...

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Abstract

The present invention provides a method for manufacturing a single mini led integrating RGB three-color light. The beneficial effect of the present invention lies in using multiple positive terminal parts and multiple negative terminal parts to prevent excessive current concentration, thereby ensuring uniform current and preventing excessive current. big fever. In addition, when forming the first trench and the second trench, the distance between the bottom of the trench and the lower surface of the n-GaN layer is h, in order to prevent the concentration of current, h should be greater than zero and less than the thickness of the n-GaN layer half of .

Description

Technical field [0001] The present invention involves the field of semiconductor components packaging manufacturing, and specifically involves a single miniled production method that integrates RGB three -color light. Background technique [0002] Use RGB three -color mini chip to make three -in -one lamp beads encounter the following problems and shortcomings: [0003] 1. The three -color MINI chip needs to be separated, and arranged to the specified position of the substrate according to the set distance and other requirements. This requires three huge amounts of transfer, and at the same time, higher accuracy and more complicated equipment are required. [0004] 2. When repaired a chip in a three -in -one lamp bead, it is more difficult and it is difficult to affect and damage the chip that is close to the side. [0005] At present, there is another way to make a single RGB three -color MINI LED: first transfer the blue light (or purple light) chip to the substrate, perform th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/50H01L21/78
CPCH01L33/0066H01L33/0075H01L33/0095H01L33/50H01L21/78H01L2933/0041
Inventor 罗雪方瞿澄李雍胡玲玲陈文娟周良军薛水源
Owner 罗化芯显示科技开发(江苏)有限公司