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Stamping and cutting device and equipment

A cutting and stamping rod technology, applied in the field of stamping and lamination, can solve the problems of unqualified pad cleanliness, easy access, affecting pad quality, etc., so as to reduce the probability of human hands touching the pad and improve the cleanliness. Effect

Active Publication Date: 2022-01-25
CAMELOT QINGYUAN HYTEC TECH INVESTMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high-temperature adhesives need to be pasted manually. When manually pasting, hands are easy to touch the pads to be bonded, resulting in unqualified cleanliness of the pads and affecting the quality of the pads.

Method used

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  • Stamping and cutting device and equipment
  • Stamping and cutting device and equipment
  • Stamping and cutting device and equipment

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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PUM

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Abstract

The present application provides a stamping and cutting device and equipment. The stamping and cutting device described above includes a mounting bracket, a transmission assembly and a stamping assembly; the transmission assembly includes two transmission parts; the stamping assembly is located between the two transmission parts, and the stamping assembly includes a driving part, a stamping rod and a guide part, and the driving part and the installation The bracket is connected, the driving part is also connected with the stamping rod, the guide part is provided with a guide through hole, and the stamping rod is passed through the guide through hole and moves relative to the guide part. Driven by the driver and guided by the guide, the stamping rod moves towards the high-temperature tape, so that the stamping rod will stamp the tape with a specified shape and attach it to the pad, eliminating the need for manual lamination by the operator, reducing manual contact The probability of reaching the pad, thereby improving the cleanliness of the pad.

Description

technical field [0001] The invention relates to the technical field of stamping and bonding, in particular to a stamping and cutting device and equipment. Background technique [0002] With the development of science and technology, the market demand for electronic equipment is becoming more and more light and thin, small size, high heat dissipation, and the demand for highly integrated chips is increasing, and the welding process is also continuously improved. In order to meet high density and high precision Component assembly, a bonding process has emerged. The bonding process is to connect metal wires such as gold wires or aluminum wires to the pads and components through a special welding process. The surface of the pad must be absolutely clean, free from organic pollution, without any tiny particles, and the surface is required to be flat. [0003] In the traditional process, after the functional test and visual inspection of the circuit board, the surface of the pad ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C63/02B29C69/00
CPCB29C63/02B29C63/0004B29C69/001
Inventor 伍海霞谢新艳李增才
Owner CAMELOT QINGYUAN HYTEC TECH INVESTMENT