Camera module, composite substrate, photosensitive component and manufacturing method thereof

Abstract

The invention relates to a composite substrate which comprises a circuit board provided with a first surface for attaching a photosensitive chip, an opposite second surface, a first side surface and an opposite second side surface; a heat dissipation rib arranged on the second surface of the circuit board, wherein at least one part of the heat dissipation rib is located in an area overlapped witha chip attaching area, the heat dissipation rib is a strip-shaped heat dissipation rib, and at least one end surface of the strip-shaped heat dissipation rib extends to the first side surface or the second side surface; and a back surface molding part manufactured on the second surface through a molding process, and the back surface molding part and the heat dissipation rib are combined into a whole. The invention further provides a corresponding photosensitive component, a camera module and a corresponding manufacturing method. According to the invention, the warping of the circuit board canbe prevented in the molding process of the circuit board jointed board, overall warping of the circuit board jointed board can be prevented in the manufacturing process of the circuit board jointed board; the production yield of the composite substrate and the photosensitive component can be improved.

Description

technical field [0001] The present invention relates to the technical field of camera modules, and in particular, the present invention relates to a camera module, a photosensitive assembly for a camera module, a composite substrate and a manufacturing method thereof. Background technique [0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been rapidly developed and advanced, and in recent years, camera modules The group has been widely used in many fields such as medical treatment, security, industrial production and so on. [0003] In order to meet more and more extensive market demands, high pixel, large chip, small size, and large aperture are the irreversible development trends of existing camera modules. However, it is very difficult to realize the four requirements of high pixel, large chip, small size and large aperture ...

AI Technical Summary

Problems solved by technology

During the manufacturing process of circuit board imposition, as the ambient temperature changes, it generally changes between room temperature and 180 degrees (during baking and molding processes). Due to the large area of ​​circuit board imposition and weak structural strength, it is more It is easy to be bent due to the influence of temperature, which affects the flatness and makes it difficult to attach the chip, and the flatness of the chip after attachment cannot be guaranteed

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