Camera module, composite substrate, photosensitive component and manufacturing method thereof

Abstract

The invention relates to a composite substrate. The composite substrate comprises a circuit board which is provided with a first surface for attaching a photosensitive chip and an opposite second surface; a radiating rib which is arranged on the second surface, and at least one part of the radiating rib is positioned in an area overlapped with the chip attaching area; and a back surface molding part which is manufactured on the second surface through a molding process, and the back surface molding part, the radiating ribs and the circuit board are combined into a whole. The invention further provides a corresponding photosensitive assembly, a camera module and a corresponding manufacturing method. According to the composite substrate, deformation of the photosensitive chip can be avoided or inhibited at a relatively small space dimension cost.

Description

technical field [0001] The present invention relates to the technical field of camera modules, in particular, the present invention relates to a camera module, a composite substrate for a camera module, a photosensitive component and a manufacturing method thereof. Background technique [0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been rapidly developed and advanced, and in recent years, camera modules The group has been widely used in many fields such as medical treatment, security, industrial production and so on. [0003] In order to meet more and more extensive market demands, high pixel, large chip, small size, and large aperture are the irreversible development trends of existing camera modules. However, it is very difficult to realize the four requirements of high pixel, large chip, small size and large aperture in ...

AI Technical Summary

Problems solved by technology

Note that for ease of understanding, Figure 24 The picture shown is exaggerated, in fact the amount of warping may be only ten to twenty microns, but this degree of warping is enough to have a negative impact on image quality

For example, this kind of curvature may cause the field curvature of the camera module to be too large. At this time, the image obtained by the camera module appears to be normal in the center but poor in the surrounding area.

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