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Photosensitive component, camera module and manufacturing method of photosensitive component

A technology of photosensitive components and production methods, which is applied in the directions of image communication, electrical components, printed circuit manufacturing, etc., can solve the problems of high pixels, large chip bending, etc., and achieves the advantages of reducing thickness, improving heat dissipation efficiency, and ensuring imaging quality. Effect

Active Publication Date: 2021-02-23
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is, regardless of molded or non-molded packaging, it is impossible to solve the bending problem of high pixels and large chips

Method used

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  • Photosensitive component, camera module and manufacturing method of photosensitive component
  • Photosensitive component, camera module and manufacturing method of photosensitive component
  • Photosensitive component, camera module and manufacturing method of photosensitive component

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Embodiment Construction

[0039] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0040] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0041] In the drawings, the thickness, size and shape of objects have been slight...

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Abstract

The invention relates to a photosensitive component. The photosensitive component comprises a circuit board, a photosensitive chip and a metal wire. The first surface of the circuit board is providedwith protruding structures and a chip attaching area, and the protruding structures are distributed in the chip attaching area. The photosensitive chip is attached to the first surface through adhesive glue, and the adhesive glue is at least arranged between the top surface of the protruding structure and the bottom surface of the photosensitive chip. The photosensitive chip is electrically connected with the circuit board by a metal wire in a lead bonding manner. The invention further provides a corresponding camera module and a photosensitive component manufacturing method. According to theinvention, the deformation of the photosensitive chip can be avoided or inhibited at a relatively small space dimension cost. According to the photosensitive component and the camera module, the structural strength of the circuit board can be improved. According to the photosensitive component and the camera module, the heat dissipation efficiency of the photosensitive chip can be improved.

Description

technical field [0001] The invention relates to the field of camera module technology, in particular, the invention relates to a camera module, a photosensitive component used in the camera module and a manufacturing method thereof. Background technique [0002] With the popularization of mobile electronic devices, related technologies of camera modules used in mobile electronic devices to help users acquire images (such as video or images) have developed rapidly and improved rapidly, and in recent years, camera modules Groups have been widely used in many fields such as medical treatment, security, industrial production and so on. [0003] In order to meet more and more extensive market demands, high pixel, small size, and large aperture are irreversible development trends of existing camera modules. However, it is very difficult to achieve the three requirements of high pixel, small size and large aperture in the same camera mold. For example, the compact development of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/55H04N23/54H05K3/305H05K2203/049H05K2201/10151H05K3/4691H05K2201/10121H05K1/0271H04N23/57H05K1/181H05K3/303H05K2203/1316
Inventor 栾仲禹黄桢刘丽干洪锋李婷花孙鑫翔
Owner NINGBO SUNNY OPOTECH CO LTD
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