This invention relates to the field of
pressure sensor packaging technology and discloses a micro
differential pressure sensor packaging structure, including a PCB board. A MEMS
chip is bonded to the inside of a mounting slot using conductive
adhesive. Gold wires are mounted at one end of both the ASIC
chip and the MEMS
chip, with the other end of the gold wires mounted on the upper surface of the PCB board. Gold wires are also installed between the ASIC chip and the MEMS chip. A cover is mounted on the upper surface of the PCB board. A limiting structure is provided at the upper end of the substrate, and the MEMS chip is positioned in the middle of the limiting structure. This invention utilizes the fact that the
thermal expansion coefficient of the substrate is between that of the MEMS chip and the PCB board, forming a gradient transition. This reduces
interfacial stress caused by material expansion differences during temperature changes. The highly thermally conductive
ceramic can quickly disperse the working heat of the MEMS chip, reducing the
temperature gradient and avoiding piezoresistive bridge imbalance caused by local
thermal deformation, thus preventing zero-point drift of the MEMS chip. Simultaneously, the high
hardness and Young's modulus of the
ceramic suppress the transmission of energy from PCB board bending or vibration, protecting the MEMS chip from external mechanical impacts.