275results about How to "Curb bending" patented technology

The invention aims to provide a direct fluid type writing implement which has no possibility of the ink in an ink tank leaking from the penpoint side, get ready for writing in a short time by a quick change of air and the ink at the initial discharge of the ink, and moreover can simplify the structure. The direct fluid type writing implement comprises the penpoint, an ink occluding body connected to the rear end of the penpoint, the ink tank disposed in the rear of the ink occluding body and storing the ink directly and communication pipes connecting the ink tank with the ink occluding body. The communication pipes are provided in a plurality. The respective front ends of the communication pipes are opened. The ink occluding body has a high-density part and a low-density part connected to the high-density part in the rear of this part. The respective front ends of the communication pipes and the rear end of the penpoint are connected to the high-density part.

A light deflector includes a fixing portion, a movable portion and a reinforcing member. The movable portion includes a mirror portion for deflecting light by swinging about a predetermined swing axis, a torsion bar fixedly supported on the fixing portion and having an axis serving as the swing axis, and a supporting body configured to support the mirror portion and fixed to the torsion bar. The supporting body includes a contact surface to be held in contact with the mirror portion and a non-contact surface opposite to the contact surface. The reinforcing member is provided only on the non-contact surface out of the contact surface and the non-contact surface of the supporting body and reinforces the supporting body and adjusts a center of gravity of the movable portion so that the center of gravity of the movable portion is located on the axis.

The aim of the invention is to guide wire for medical treatment capable of being easily introduced into a blood vessel from a blood vessel guide port at a femoral, a brachium, or a radial, easily meandered in the blood vessel, and hard to be erroneously advanced into the blood vessel at a branched part, comprising a metal core covered with a resin having a tip part bent in a smooth curved shape, characterized in that the diameter of the guide wire including a resin layer is 0.46 to 1.02 mm, an angle formed by the extension line of the tip part of the guide wire relative to a wire base line is 40 to 70 DEG , and the width dimension of the curved part is 2 mm or longer to less than 10 mm.

A substrate for a semiconductor device is provided, including: a substrate; a transistor, formed on the substrate, that includes a semiconductor layer, and a gate electrode disposed so as to be opposed to the semiconductor layer with a gate insulating film interposed therebetween; and an underlying film disposed below the semiconductor layer, as an underlayer of the transistor, and formed in an island shape so as to at least partially overlap the semiconductor layer, in a plan view of the substrate.

The invention relates to a yarn splicing device for pneumatically joining yarns, especially elastic yarns, with a splicing body having a vacuum-loadable splicing channel which can be operated by means of a The covering element is closed and, moreover, a support is arranged in the region of the splicing channel, which supports the fixing of the yarn ends. According to the invention, it is provided that the supporting element consists of a spring wire (36) and a cover element (23), wherein the spring wire (36) is positioned in an opposite position in the spliced ​​body (19). In the groove (35) that moves angularly in the splicing channel (20), that is, the yarn ends (31, 32) to be spliced ​​are clamped between the covering element (23) and the spring wire ( 36) Between.

An apparatus for supporting a worker's body part, for example a surgeon's arm, is provided. The body part is supported by a base movably supported by a support. The apparatus has a free mode and a limitation mode, which are switchable. When it is determined that the body part is attempting to move the base or a fastening member, the operating mode is switched to the free mode. When it is determined that the body part is not attempting to move the base or the fastening member, the operating mode is switched to the limitation mode. The free mode allows the fastening member to fasten the body part on the base and allows a brake to release limitations to the motions of the base. The limitation mode allows the fastening member to release the body part from being fastened and allows the brake to limit the motions of the base.

Disclosed are a production apparatus and a production process in which a thick and high-quality single crystal film can be formed on both sides of a colored substrate. Both single crystal growth surfaces of a colored substrate which has been fixed through a substrate holder within a reactor are substantially evenly heated by at least one pair of infrared irradiation devices each comprising an infrared generating source and a reflecting mirror to produce a single crystal.

The present invention provides an electronic parts installation apparatus, capable of stably and accurately recognizing hold mode of the electronic parts. The apparatus includes a substrate holding part; a member supply part for supplying the electronic parts; a loading head having an adsorption nozzle; a loading head shifting mechanism capable of locating the loading head arbitrarily; a filming unit arranged on the loading head to film the electronic part absorbed by the adsorption nozzle; a filming reflection mirror extended between the member supply part and the substrate holding part and having only one reflecting plane; and an image processing device for judging the position and angle of the absorbed electronic part relative to the absorption nozzle according to the filming image of the electronic part obtained through reflection of the filming reflection mirror, wherein the reflecting plane of the filming reflection mirror is an inclined plane which adopts a bisecting line between a central line of the adsorption nozzle and the line of sight of the filming unit as its perpendicular line.

An endoscopically inserting surgical tool is composed of an elongated flexible cord to be passed through a tool guide channel on an endoscope, and a tool action mechanism mounted on a fore distal end of the flexible cord to be projected out of the tool guide channel. The flexible cord has such a length that, when the tool action mechanism is projected out of a tool exit opening at the end of the tool guide channel, a proximal end portion of the flexible cord still remains outside and rearward of a tool entrance way which is provided on a manipulating head grip of the endoscope as an approach to the tool guide channel. A proximal end portion of the flexible cord is gripped in a rotary tool adjustor which is manipulable to turn the tool action mechanism clockwise or counterclockwise together with the flexible cord in the tool guide channel of the endoscope.

The object of the invention is to provide a special-shaped wire section forming device, which can solve the problem of the bending generated on the wire section before and after forming, the device has high dimension accuracy and good forming performance. The special-shaped wire section forming device has a four-roller type cross-shaped roller module as a forming unit, preferably, straighteners are respectively provided at a front section and a rear section of the forming unit, on the forming unit, a non-driven four-roller type cross-shaped roller module and a four-roller type cross-shaped roller module driven by the power are provided in series.

The invention provides an engagement chain type driving device which can realize the advance and retreat drive without the auxiliary guide mechanism, and can realize the reduction in size and light, and ensure the high free degree for the design of other parts, the arrangement position of the devices, and the like, and can make the maintenance easy and reduce the coveying load of the workpieces, at the same time, when the suepension or suspension arm supporting is adopted, the auxiliary guide mechanism is also not required. The invention relates to an engagement chain type driving device including a pair of driving sprockets, a pair of engagement chains, and a driving source, wherein the inner tooth plates and outer tooth plates being brought opposite to each other and into contact with each other when the engagement chains are integrated by the pair of driving sprockets, such that the flat surfaces hold the chain engagement position.

A secondary battery, which has no raw material injection spot and a burr on a lower surface of the insulating member. The sidewalls are formed on the opposite side to the side on which bending stress is applied, and the sidewalls act as a structural resistor, which result in preventing the plate from bending. The insulating member inserted into the container has an inversely stepped part to keep the insulating member from escaping from the container. A fabrication method of the secondary battery whereby an insulating member is prepared by inserting a raw material from the side on which the sidewall is to be formed into a mold and solidifying the inserted raw material, the insulating member is positioned over the electrode assembly inserted into a container, and a cap is coupled to an opening of the container with the insulating member positioned over the electrode assembly.

A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

The invention discloses a bending processing method of a heat exchanger. According to the method, the heat exchanger can be bent only by holding a position of a holding part of the heat exchanger and enabling the holding part to bend according to a ruled track through controlling gestures of the holding part without using a bending mould. At this moment, a contact position of a free part of the heat exchanger which is not held and a guide part is determined by a reacting force generated during the bending process, and no limitation force is generated by the free part which is not held, so that buckling generated by the heat exchanger during the bending process can be avoided. The bending processing method of the heat exchanger, disclosed by the invention, can suppress deformation and buckling of heat transfer fins.

A nozzle for holding a substrate may include a nozzle head and a nozzle body. The nozzle head may provide the substrate with compressed air. The nozzle body may be connected to the nozzle head. The nozzle body may be arranged facing the semiconductor substrate. The nozzle body may have a substantially flat supporting surface which provides a uniform gap between the substrate and the nozzle body. The nozzle body may have a first passageway which allows the compressed air to pass through toward the substrate to form a vacuum between the substantially flat supporting surface and the substrate.