Lubricating cover plate and preparation method

Abstract

The invention belongs to the technical field of lubricating cover plates, and discloses a lubricating cover plate and a preparation method thereof. The outer side of a DE main plate layer of the lubricating cover plate is wrapped with a lubricating glue layer, and the main plate layer is formed by stacking multiple layers of phenolic resin plates and artificial fiber plates through hot pressing; the phenolic resin plate comprises paper and phenolic resin composite layers located on the two sides of the paper. The artificial fiber plate is at least one of a high-density fiber plate, a medium-density fiber plate, a solid wood particle plate, a recycled paper pulp plate and a bamboo fiber plate. The organic silicon containing methyl or phenyl is used as a modifier component, so that the decomposition temperature of a main structure is increased, the crosslinking degree of the cured modified phenolic resin is increased, and the heat resistance, corrosion resistance and mechanical properties of the modified phenolic resin are obviously enhanced; a molybdenum compound material is used as a modifier component, so that the erosion resistance and the abrasion resistance of the phenolic resin material can be improved, a relatively large friction resistance coefficient is maintained, and meanwhile, the phenolic resin material has relatively high heat resistance.

Description

technical field [0001] The invention belongs to the technical field of lubricating cover plates, in particular to a lubricating cover plate and a preparation method. Background technique [0002] At present: phenolic resin boards are usually made of bleached wood pulp paper as a reinforcement and phenolic resin as a resin binder. Once phenolic resin is heated and formed, it solidifies and cannot be molded into other products. [0003] As a nano-carbon material, graphene has an electron mobility of more than 15000cm / (V·S) at room temperature, and a resistivity of only about 10Ω·cm, which is currently the material with the smallest resistivity; graphene has excellent thermal Conductivity, its thermal conductivity can be as high as 5300W / m K, much higher than carbon nanotubes and diamond. Graphene not only has mechanical properties such as high strength, high elastic modulus, and toughness, but also has excellent functional properties such as thermal conductivity, electrical ...

AI Technical Summary

Problems solved by technology

[0004] The existing phenolic resin board has poor heat resistance, corrosion resistance and mechanical properties, and poor wear resistance

[0005] Through the above analysis, the existing problems and defects of the prior art are: the existing phenolic resin board has poor heat resistance, corrosion resistance and mechanical properties, and poor wear resistance

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