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Floating device protection circuit and floating device protection device

A protection circuit and floating ground technology, applied in the field of microelectronics, can solve problems such as interference numbers, difficulty, and abnormal products

Active Publication Date: 2021-02-19
SHENZHEN GONGJIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing floating ground interface circuit design scheme, for floating products, it is difficult to pass the electrostatic discharge (Electrostatic Discharge, ESD) test, ESD interference is directly introduced into the digital ground of the chip, causing abnormalities in the product

Method used

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  • Floating device protection circuit and floating device protection device
  • Floating device protection circuit and floating device protection device
  • Floating device protection circuit and floating device protection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] For this example, see figure 1 , shows a floating device protection circuit, which includes a main control module 10 , a common mode filter module 20 , a protection module 30 and a floating interface circuit 40 .

[0044] The common mode filter module 20 is connected in series on the signal line between the main control module 10 and the floating interface circuit 40, and the common mode filter module 20 is used to filter the common mode interference between the signal lines; the protection module 30 includes an electrostatic isolation unit 31 and an electrostatic isolation unit 31. The protection unit 32, the electrostatic isolation unit 31 is connected to the floating interface circuit 40 for isolating static electricity. ground interface circuit 40 .

[0045] It can be understood that there is no special ground wire in the device that is electrically connected to the earth. In EMC testing, the earth refers to the reference floor. If all circuits in the device produ...

Embodiment 2

[0049] For this example, see figure 2 , shows a floating device protection circuit connected through the USB2.0 interface circuit 41, the USB2.0 interface circuit 41 includes a group of communication terminals (ie, the first data negative line terminal D- and the second data positive line terminal D+ ), a power supply terminal VCC, a first ground terminal GND1, a second ground terminal GND2 and a third ground terminal GND3.

[0050] The electrostatic isolation unit 31 corresponding to the USB2.0 interface circuit 41 includes: a first magnetic bead F1 , a second magnetic bead F2 , a first isolation capacitor C1 and a first isolation resistor R1 .

[0051] The power end of the USB2.0 interface circuit 41 is connected to the power interface through the first magnetic bead F1; the first ground end of the USB2.0 interface circuit 41 is connected to the ground through the second magnetic bead F2; the second end of the USB2.0 interface circuit 41 The ground terminal and the third g...

Embodiment 3

[0060] For this example, see Figure 4 , shows a floating device protection circuit connected through the USB3.0 interface circuit 42, the USB3.0 interface circuit 42 includes three groups of communication terminals (ie, the first data negative terminal D_N, the first data positive terminal D_P, The second data negative terminal SSRX_N, the second data positive terminal SSRX_P, the third data negative terminal SSTX_N and the third data positive terminal SSTX_P), the power supply terminal VBUS, the power supply ground terminal GND_PWR, the signal ground terminal GND_SGNL, ​​the first shell Pin SHIELD1 and second shell pin SHIELD2.

[0061] The electrostatic isolation unit 31 corresponding to the USB3.0 interface circuit 42 includes: a third magnetic bead F3, a fourth magnetic bead F4, a second isolation capacitor C2 and a second isolation resistor R2.

[0062] The power terminal of the USB3.0 interface circuit 42 is connected to the power interface through the third magnetic b...

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Abstract

The embodiment of the invention discloses a floating device protection circuit and floating device protection device, and the floating device protection circuit comprises a main control module, a common mode filtering module, a protection module and a floating interface circuit. According to the invention, the common-mode filtering module is connected in series with a signal line between the maincontrol module and the floating interface circuit, the common mode filtering module is used to filter the common-mode interference between the signal lines, an electrostatic isolation unit of the protection module is connected with the floating interface circuit to isolate the static electricity via the electrostatic isolation unit, and an electrostatic protection unit of the protection module isconnected with the signal line between the common mode filtering module and the floating interface circuit to protect the main control module from being damaged by static electricity during electrostatic discharge by utilizing the electrostatic protection unit.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a floating device protection circuit and a floating device protection device. Background technique [0002] The current floating ground interface circuit design scheme is difficult for floating ground products to pass the Electrostatic Discharge (ESD) test. ESD interference is directly introduced into the digital ground of the chip, causing abnormalities in the product. Contents of the invention [0003] In view of the above problems, the present invention proposes a floating device protection circuit and a floating device protection device. [0004] An embodiment of the present invention proposes a floating device protection circuit, which includes a main control module, a common-mode filter module, a protection module and a floating interface circuit; [0005] The common-mode filter module is connected in series on the signal line between the main control module and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H03H7/01H03H7/06G06F13/40
CPCH05K9/0067H03H7/0153H03H7/06G06F13/4068G06F2213/0042
Inventor 张绪坤朱余浩涂玖佳陈志军秦祥宏
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD