Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor package

A semiconductor and carrier substrate technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problem of damage to integrated circuit semiconductors and other circuit components

Pending Publication Date: 2021-02-23
MEDIATEK INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electrostatic discharge can damage semiconductors and other circuit components in integrated circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor package
  • Semiconductor package
  • Semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In the following detailed description of the embodiments of the invention, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustrations certain preferred embodiments in which the disclosure may be practiced. .

[0038] These embodiments have been described in sufficient detail to enable those skilled in the art to practice them, and it is to be understood that other embodiments may be utilized and that mechanical, chemical, Electrical and procedural changes. scope of this disclosure. Accordingly, the following detailed description should not be taken as limiting, and the scope of embodiments of the present invention is defined only by the appended claims.

[0039] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly on the other element or layer. Connected or coupled to anothe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor package includes: a carrier substrate having an upper surface; a semiconductor die mounted on the upper surface; a first bonding wire connecting the semiconductor die to the carrier substrate; an insulating material encapsulating the first bonding wire; a component mounted on the insulating material, where the component includes a metal layer; a second bonding wire connecting the metal layer of the component to the carrier substrate, the metal layer and the second bonding wire constituting an electromagnetic interference shielding structure; and a molding compound covering theupper surface of the carrier substrate and encapsulating the semiconductor die, the component, the first bonding wire, the second bonding wire, and the insulating material. Since the metal layer and the second bonding wire are used to form an electromagnetic interference shielding structure, the semiconductor die can be shielded from EMI interference and ESD damage.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor package. Background technique [0002] As known in the art, electrostatic discharge (ESD) and electromagnetic interference (EMI) are unresolved problems in the field of semiconductor technology. Electrostatic discharge can damage semiconductors and other circuit components in integrated circuits. EMI is caused by electromagnetic radiation and is an important consideration in the design of electronic circuits. Electronic circuits and components that carry changing electrical signals emit electromagnetic radiation. [0003] The industry wishes to shield sensitive components from any source of electromagnetic radiation. It is also desirable to reduce the likelihood of ESD damage to circuit components in semiconductor packages. Contents of the invention [0004] In view of this, the present invention provides a semiconductor package to solve the above pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/18H01L23/552H01L23/31H01L23/488
CPCH01L23/552H01L23/3128H01L24/13H01L25/18H01L2224/13009H01L2224/13016H01L2224/48227H01L2224/8592H01L2924/15311H01L2924/15192H01L2924/3025H01L2224/73253H01L2224/32145H01L2224/73265H01L2224/0401H01L2224/04042H01L2224/73204H01L2224/92125H01L2224/13147H01L2224/13144H01L2224/13139H01L2224/131H01L2224/45147H01L2224/45144H01L2224/45139H01L2224/32225H01L2224/32245H01L2224/73215H01L25/0657H01L2225/0651H01L2225/06517H01L2225/06558H01L23/3135H01L2225/06575H01L2924/19107H01L2924/00012H01L2924/00014H01L2924/014H01L2924/00H01L23/3121H01L23/49811H01L23/49861
Inventor 蔡宪聪
Owner MEDIATEK INC