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A vacuum pressing plate for product packaging

A product packaging and vacuuming technology, applied in packaging, pressurized/gasified packaging, etc., can solve problems such as residual air, and achieve the effect of reducing packaging time, reducing vacuum impact, and compact structure

Active Publication Date: 2022-03-15
JIANGSU UNION SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a vacuum pressing plate for product packaging, to solve the problem of residual air in the bag proposed in the above-mentioned background technology

Method used

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  • A vacuum pressing plate for product packaging
  • A vacuum pressing plate for product packaging
  • A vacuum pressing plate for product packaging

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see figure 1 , the present invention provides a technical solution: a vacuum press plate for product packaging, including an antistatic aluminum foil bag 1, a product carrier 2, a desiccant pack 3 and an auxiliary press plate 5, the desiccant pack 3 is placed on the At the center of the upper end surface of the product carrier 2, the desiccant package 3 and the product carrier 2 are filled in the antistatic aluminum foil bag 1, the auxiliary pressure pl...

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Abstract

The invention discloses a vacuum pressing plate for product packaging, which includes an antistatic aluminum foil bag, a product carrier, a desiccant package and an auxiliary pressing plate, and the desiccant package is placed at the center of the upper end surface of the product carrier loaded with products , the desiccant package and the product carrier are filled in an antistatic aluminum foil bag, the auxiliary pressure plate is pressed on the upper surface of the antistatic aluminum foil bag, a pneumatic smoothing mechanism is set on the auxiliary pressure plate, and the auxiliary pressure plate is pressed down During the process, the piston push block is compressed inward, so that the air stored in the negative pressure generating chamber can be dispersed to the air diffuser holes on the outer wall of the telescopic pressure plate through the exhaust channel, and the antistatic aluminum foil bag will be compressed in a telescopic pressure after being sprayed out through the air diffuser holes. The plate is centered and smoothed outward, so that the upper surface of the antistatic aluminum foil bag is kept smooth and flat. Vacuum effect, reduce packaging time.

Description

technical field [0001] The invention belongs to the related technical field of COF packaging, and in particular relates to a vacuum pressing plate used for product packaging. Background technique [0002] COF (Chip On Flex, or, Chip On Film), commonly known as chip-on-chip film, is a soft film structure technology that fixes integrated circuits (IC) on flexible circuit boards, using soft additional circuit boards as packaged chips The carrier combines the chip with the flexible substrate circuit, or simply refers to the flexible additional circuit board of the unpackaged chip, including tape and reel packaging production (TAB substrate, whose process is called TCP), flexible board connection chip components, flexible IC carrier Board packaging ink: It is an important material for printing. It expresses patterns and characters on the substrate by printing or inkjet painting. Products must be shipped in vacuum-packed antistatic aluminum foil bags. Vacuum bag is a packaging m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B31/04B65B61/20
CPCB65B31/04B65B61/20
Inventor 赵原刘明群刘鹏飞
Owner JIANGSU UNION SEMICON
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