Wave-soldering tin coating tool for DIP-series packaging components

A component and wave soldering technology, applied in auxiliary devices, manufacturing tools, welding equipment, etc., can solve the problems of unguaranteed tinning quality and low tinning efficiency, so as to improve tinning efficiency, ensure welding quality, and ensure consistency sexual effect

Inactive Publication Date: 2021-03-09
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem in the prior art that the efficiency of tinning is low and the quality of tinning is not guaranteed for DIP series packaged components with high density, the present invention provides a wave soldering tinning tooling for DIP series packaged components, which has a simple structure , low cost of tooling, easy to operate, effectively save human resources and man-hours spent on tinning, improve the efficiency of tinning, and can effectively solve the contradiction between tinning work and increased tasks, and ensure the welding quality of components

Method used

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  • Wave-soldering tin coating tool for DIP-series packaging components
  • Wave-soldering tin coating tool for DIP-series packaging components
  • Wave-soldering tin coating tool for DIP-series packaging components

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Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0036] The present invention provides a DIP series packaging component wave soldering tin frock, such as figure 1 , figure 2 and image 3 As shown, it includes the body of the wave soldering tin enamel tooling body, and the wave soldering tin enamel tooling body includes the tooling base plate 1 and the tooling cover plate 3 that hold the DIP series package components 4; the tooling base plate 1 and the tooling cover plate 3 are both rectangular plates, and the tooling The base plate 1 is provided with several grooves 12 for DIP series packaged components, which are used to place the DIP series packaged components 4; the tooling cover plate 3 is connected to the tooling base plate 1 through an adsorption unit.

[0037] The clamping surfaces of the tooling base plate 1 and the tooling cover...

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Abstract

The invention provides a wave-soldering tin coating tool for DIP-series packaging components. The wave-soldering tin coating tool comprises a wave-soldering tin coating tool body; the wave-soldering tin coating tool body comprises a tool bottom plate and a tool cover plate which are used for clamping the DIP-series packaging components; the tool bottom plate and the tool cover plate are both rectangular plates; multiple DIP-series packaging component grooves are formed in the tool bottom plate and used for containing the DIP-series packaging components; and the tool cover plate is connected with the tool bottom plate through an adsorption unit. The tool is simple in structure, low in tool cost and convenient to operate, manpower resources and labor hours consumed by tin coating are effectively saved, the tin coating efficiency is improved, the contradiction between tin coating work and task load increase can be effectively solved, and the welding quality of the components is guaranteed.

Description

technical field [0001] The invention relates to the field of electronic assembly, in particular to a wave soldering tin-enamelling tool for DIP series packaging components. Background technique [0002] In the production process of electronic products, DIP series packaging components are required to be tinned before installation. DIP series packaged components are usually tinned manually, and the operator holds the device in a tin pot to tinn one by one. The tinning height control of the tinned device mainly depends on the operator's experience and visual judgment. The consistency, efficiency and quality are relatively high. Difference. Later, a craftsman engaged in electrical equipment developed a simple hand-held tinning tool, which only needs to place the device on the tooling, and then dip the lead wires into the tinning furnace to complete the tinning work. This method of using simple tooling can solve the problem of consistency, and the efficiency has also been impro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/08B23K3/08
CPCB23K1/085B23K3/08
Inventor 姜文明黄文红陈悌义汪强王泱洋刘辉
Owner XIAN MICROELECTRONICS TECH INST
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