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A film layer protection structure and film layer attachment method

A technology of protecting structure and protective layer, applied in the direction of identification device, instrument, polarizing element, etc., can solve the problems of different adhesion force, the film body cannot be separated smoothly, etc., to reduce the viscosity and facilitate tearing.

Active Publication Date: 2022-05-03
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a film layer protection structure and a film layer attachment method, which are used to solve the problem that the film layer body cannot be smoothly separated due to different adhesive forces in the process of tearing off the release film and the protective layer in the prior art. question

Method used

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  • A film layer protection structure and film layer attachment method
  • A film layer protection structure and film layer attachment method
  • A film layer protection structure and film layer attachment method

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Embodiment

[0035] Such as image 3 As shown, the film protection structure 100 of the present invention includes a first protection layer 110 , a film body 120 and a second protection layer 130 .

[0036] The first protective layer 110 and the second protective layer 130 are attached to the two side surfaces of the film layer body 120 respectively to protect the film layer body 120 and prevent the film layer body 120 from being damaged by the outside before use, thereby increasing the cost of the product .

[0037] Such as Figure 4 As shown, specifically, the first protective layer 110 includes a substrate 111 , an adhesive layer 112 and filling particles 113 . The substrate 111 is made of resin or other flexible materials with high hardness, so as to avoid scratches on the film body 120 caused by external hard objects, thereby reducing the yield rate of the film body 120 .

[0038] The adhesive layer 112 is used to bond the substrate 111 and the film body 120. Since the first protec...

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PUM

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Abstract

The invention discloses a film layer protection structure and a film layer attaching method. The film layer protective structure is used to protect the film layer body, including a first protective layer disposed on one side surface of the film layer; a second protective layer disposed on the side surface of the film layer away from the first protective layer Filling particles, located on the side of the first protective layer close to the film layer, the inside of the filling particles is provided with a viscosity reducer. The beneficial effect of the present invention is that, in the film layer protection structure and the film layer attachment method of the present invention, the protective layer is attached to both sides of the film layer body, and a number of pressure-sensitive balls are filled inside the first protective layer. When extruded by external force, the adhesive force of the first protective layer is greater than that of the second protective layer, which makes it easy to tear off the second protective layer. When the pressure-sensitive ball is squeezed by external force, the ball ruptures, and the viscosity inside the pressure-sensitive ball is reduced. The agent overflows and reacts with the adhesive layer of the first protective layer, thereby reducing the viscosity of the first protective layer and facilitating the removal of the first protective layer.

Description

technical field [0001] The present application specifically relates to a film layer protection structure and a film layer attaching method. Background technique [0002] During the production process of the flexible and foldable module, the requirements for the peeling force (bonding force) of the first protective layer 110 are relatively high. Such as figure 1 as shown, figure 1 It is a bad structure diagram in the prior art that the cohesive force of the first protective layer is too low. When the adhesive force between the first protective layer 110 and the panel film body 120 is small, when the second protective layer 130 is torn off, the film body 120 will be taken away together, resulting in a reverse release type. Such as figure 2 as shown, figure 2 It is a poor structure diagram in the prior art where the bonding force of the first protective layer is too high. When the bonding force between the first protective layer 110 and the panel film body 120 is high, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/30G02B1/14G02B5/30
CPCG09F9/301G02B1/14G02B5/3041
Inventor 游魁华
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD