A state-configurable in-situ aging sensor system

A sensor and state technology, which is applied in the direction of instruments, measuring devices, electronic circuit testing, etc., can solve the problems of uncomplicated logic circuit aging prediction, etc., and achieve the effect of accurate delay measurement and high flexibility

Active Publication Date: 2021-09-21
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above deficiencies in the prior art, the present invention provides a state-configurable in-situ aging sensor system that solves the problem that the prior art cannot predict the aging of complex logic circuits

Method used

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  • A state-configurable in-situ aging sensor system
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  • A state-configurable in-situ aging sensor system

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Embodiment Construction

[0013] The specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.

[0014] like figure 1 As shown, the state-configurable in-situ aging sensor system includes an inverter, n buffer modules and a first counter; each buffer module includes a sequentially connected state configuration unit, a mode selector and a buffer, and each buffer The mode selector in the module is the external input terminal of the buffer module, and the buffer in each buffer module is the output terminal of the buffer m...

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Abstract

The invention discloses a state-configurable in-situ aging sensor system, which includes an inverter, n buffer modules and a first counter; each buffer module includes a state configuration unit, a mode selector and a buffer connected in sequence , the mode selector in each buffer module is the external input terminal of the buffer module, and the buffer in each buffer module is the output terminal of the buffer module; the output terminal of the mth buffer module is connected to the m+1th buffer module The external input terminals of the modules are connected; the output terminal of the inverter is connected with the external input terminal of the first buffer module; the output terminal of the last buffer module is respectively connected with the input terminal of the inverter and the input terminal of the first counter. The present invention adopts the state configuration unit, so that the signal probability and signal flip rate of the intermediate node of the link can be configured, and solves the problem in the prior art that the state of the intermediate node of the sensor combination logic link is fixed, which leads to the inability to perform aging prediction on the complex logic circuit .

Description

technical field [0001] The invention relates to the field of integrated circuit aging prediction, in particular to an in-situ aging sensor system with configurable states. Background technique [0002] In integrated circuits, with the continuous reduction of transistor process dimensions, the reliability of the system has become increasingly prominent, and aging is one of the main factors affecting the reliability of integrated circuits. Many aging mechanisms, such as Negative Bias Temperature Instability (NBTI), Hot Carrier Injection (HCI), and Time-Dependent Dielectric Breakdown (TDDB), make the failure rate of integrated circuits increase rapidly over time during service life. High, it has a serious impact on the service life of the circuit, and even leads to the failure of the entire circuit system. Especially in the field of high reliability, such as space field, aircraft, motor vehicle and other systems, once the consequences of failure are unimaginable, these fields ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R31/317
CPCG01R31/2855G01R31/317
Inventor 黄乐天王梓任赵天津谢暄
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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