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A kind of semiconductor overlay precision control method and stack mark

A technology of overlay accuracy and control method, which is applied to the control method of semiconductor overlay accuracy and the field of overlay marking, which can solve the problems of wrong and inaccurate measurement results, affecting the quality of overlay overlay marking, etc., so as to improve control accuracy degree of effect

Active Publication Date: 2022-08-02
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the follow-up process often affects the quality of the overlay mark, resulting in wrong or inaccurate measurement results, hindering the quality control of the process

Method used

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  • A kind of semiconductor overlay precision control method and stack mark
  • A kind of semiconductor overlay precision control method and stack mark
  • A kind of semiconductor overlay precision control method and stack mark

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Embodiment Construction

[0039] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0040] The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0041] It should be noted that the drawings provided in this embodiment are only to illustrate the basic concept of the present invention in a schematic way, so the drawings only show the components related to the present invention rather than the number, shape and the number of components in actual implementation. ...

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Abstract

The invention discloses a method for controlling the precision of semiconductor overlay. The method includes obtaining a main measurement value according to the main overlay mark; obtaining an auxiliary measurement value according to the auxiliary overlay mark; Overlay compensation is performed on the main measurement value and the auxiliary measurement value. In addition, a semiconductor overlay mark is also disclosed. The use of the invention improves the precision of the semiconductor overlay.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method for controlling the precision of semiconductor overetching and a laminated mark. Background technique [0002] With the continuous development of electronic technology, the process size of semiconductor manufacturing is getting smaller and smaller, and the requirements for the precision of semiconductor manufacturing are also getting higher and higher. At present, in the small-scale process, in order to ensure that the overlay mark can truly reflect the alignment behavior of the overlay in the chip, the overlay mark will adopt the same design as the pattern in the chip. However, the subsequent processes often affect the quality of the overlay marks, resulting in erroneous or inaccurate measurement results, hindering process quality control. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a method for controlling the precisio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00H01L21/67
CPCG03F9/708G03F9/7084G03F9/7088H01L21/67253
Inventor 张伟
Owner CHANGXIN MEMORY TECH INC