Heat dissipation device of integrated circuit module in desk computer

Abstract

The invention discloses a heat dissipation device for an integrated circuit module in a desk computer, which comprises a base, wherein the top of the base is fixedly connected with a shell, the inner side wall of the shell is fixedly connected with a connecting plate, the side wall of the connecting plate is fixedly connected with the integrated circuit module, and the right side wall of the shell is fixedly connected with a baffle. According to the invention, through rotation of a draught fan, a rotating rod can rotate, a special-shaped gear can rotate through rotation of the rotating rod, a reciprocating plate can be driven by the special-shaped gear to do reciprocating motion, then through descending of a reciprocating rod, a pull rope pulls a knocking rod, the knocking rod is made to rotate, and when the reciprocating rod ascends, the knocking rod can quickly restore under the elastic force action of a second torsion spring, and then knocks on a filter plate to shake off dust on the filter plate, so that the dust accumulated on the filter plate is cleaned in time, the situation that the heat dissipation efficiency is reduced due to blockage of an air inlet is avoided, the heat dissipation efficiency is ensured, and stable work of equipment is ensured.

Description

Technical field[0001]The present invention relates to the field of heat sink, and more particularly to a heat dissipation device of an integrated circuit module in a desktop computer.Background technique[0002]According to the retrieval, the patent number is disclosed in CN111103951A, a computer heat dissipation device mounted on a computer chassis, comprising a chassis having a computer motherboard in which the cabinet is provided in the cabinet in the cabinet. The blowing portion, uniformly discharged from the side panel of the chassis on the same side of the blowing portion, and there is a number of heat-dissipating air holes on the side panel of the chassis opposite to the blowing portion. Under the action of the blowing portion, the external air is discharged by heat dissipating air through the heat dissipation air holes; when the blower is running, the heat dissipation blown is done once when the rib is running. During the process of the cooling fan in the chassis movement, con...

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Problems solved by technology

[0003]However, when the equipment is cooling, the air inlet will accumulate a lot of dust during the long-term suction work. If it is not cleaned in time, it will cause the air inlet If the air inlet is blocked, the heat of the internal integrated circuit module of the equipment cannot be dissipated in time, and the integrated circuit module will be difficult to work normally in the continuous high temperature, which will reduce the performance of the equipment and shorten the service life of the equipment. Therefore, we propose a A cooling device for an integrated circuit module in a desktop computer to solve the above problems

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