Efficient transferring device for SMT mounting line and use method thereof

A transfer device and placement technology, which is applied to the assembly of printed circuits with electrical components, electrical components, and printed circuit manufacturing. It can solve the problems of reducing work efficiency and achieve perfect overall structure, good transplanting effect, and high stability. Effect

Active Publication Date: 2021-05-07
苏州万旭电子元件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-efficiency transfer device for an SMT placement line and its use method, to solve the problem that the existing SMT placement line proposed in the above-mentioned background technology needs to rely on manpower to transfer products during the work process, reducing the work efficiency problem

Method used

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  • Efficient transferring device for SMT mounting line and use method thereof
  • Efficient transferring device for SMT mounting line and use method thereof
  • Efficient transferring device for SMT mounting line and use method thereof

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0030] see Figure 1-5 , an embodiment provided by the present invention: a high-efficiency transfer device for SMT mounting line and its use method, including a transfer device 1, supporting legs 12 are installed on both sides below the transfer device 1, and the supporting legs 12 An adjustment seat 13 is installed on the lower part of the body, which is convenient for adjusting the height of the work. A motor 2 is installed on one side of the transfer device 1. A chute 3 is arranged at the middle position inside the front end of the transfer device 1. A wire is installed inside the chute 3. The outside of the rod 4 and the screw mandrel 4 is equipped...

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Abstract

The invention discloses an efficient transferring device for an SMT mounting line and a use method thereof, relates to the technical field of SMT mounting lines, and aims to solve the problem that in the working process of an existing SMT mounting line, products need to be transferred manually, and the working efficiency is reduced. Supporting legs are installed on the two sides of the lower portion of the transferring device, adjusting bases are installed on the lower portions of the supporting legs, a motor is installed on one side of the transferring device, a sliding groove is formed in the middle of the interior of the front end of the transferring device, a lead screw is installed in the sliding groove, a sliding block is installed outside the lead screw, a transferring mounting plate is mounted at the front end of the sliding block, a rotating shaft is mounted in the middle of the front end of the transferring mounting plate, fan-shaped clamping blocks are mounted on one sides of the exteriors of the two ends of the rotating shaft, and a fixing block is mounted on the exterior of the rotating shaft.

Description

technical field [0001] The invention relates to the technical field of SMT placement lines, in particular to a high-efficiency transfer device for SMT placement lines and a use method thereof. Background technique [0002] SMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB is a printed circuit board; SMT is surface assembly technology (surface mount technology), which is the most popular technology and process in the electronic assembly industry. ; Electronic circuit surface assembly technology, known as surface mount or surface mount technology; it is a method of mounting non-lead or short-lead surface assembly components (SMC / SMD for short, Chinese called chip components) on printed circuit boards On the surface of the substrate or the surface of other substrates, the circuit assembly technology is soldered and assembled by reflow soldering or dip soldering; in general, the electronic products we use are composed of pcb...

Claims

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Application Information

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IPC IPC(8): H05K13/04H05K3/30
CPCH05K13/046H05K3/303
Inventor 王铁成张紫滈刘泗江
Owner 苏州万旭电子元件有限公司
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