MEMS chip and electronic equipment

A technology of electronic equipment and chips, applied in the field of micro-electromechanical, can solve the problems of large edge stress of the diaphragm and affect the compliance of the diaphragm, and achieve the effects of reducing stress, improving mechanical sensitivity, and improving compliance

Inactive Publication Date: 2021-05-14
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a MEMS chip and electronic equipment, aiming to solve the problem that the edge stress of the diaphragm in the traditional MEMS chip is relatively large and affects the compliance of the diaphragm

Method used

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  • MEMS chip and electronic equipment
  • MEMS chip and electronic equipment

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses an MEMS chip and electronic equipment. The MEMS chip comprises a substrate, a vibrating diaphragm and a back polar plate which are sequentially arranged in a stacked mode. The MEMS chip further comprises a first supporting part arranged between the substrate and the vibrating diaphragm and a second supporting part arranged between the vibrating diaphragm and the back pole plate, and the projection of the first supporting part on the vibrating diaphragm and the projection of the second supporting part on the vibrating diaphragm are arranged in a staggered mode. According to the invention, the vibrating diaphragm is supported on the substrate through the first supporting part, so that the periphery of the vibrating diaphragm and the substrate are relatively fixed; and the back pole plate is supported on the vibrating diaphragm through the second supporting part, so that the back pole plate and the vibrating diaphragm are separated to form a vibration gap, thereby facilitating vibration of the vibrating diaphragm. The first supporting part and the second supporting part are arranged at the two opposite ends of the vibrating diaphragm, and the projection of the first supporting part on the vibrating diaphragm and the projection of the second supporting part on the vibrating diaphragm are staggered, so that the stress at the anchor point of the vibrating diaphragm can be reduced, the compliance of the vibrating diaphragm can be improved, and the mechanical sensitivity of the MEMS chip can be improved.

Description

technical field [0001] The invention relates to the field of micro-electromechanical technology, in particular to a MEMS chip and electronic equipment. Background technique [0002] With the continuous advancement of science and technology, people's requirements for the portability of electronic equipment are gradually increasing. Specifically, users hope that the volume of existing electronic products such as mobile phones, watches, and bracelets will continue to decrease. Therefore, MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) is more and more widely used in electronic products. Taking the MEMS microphone among them as an example, in the traditional MEMS microphone, the way of supporting and fixing the diaphragm leads to a large edge stress of the diaphragm, which affects the compliance of the diaphragm. Contents of the invention [0003] The main purpose of the present invention is to provide a MEMS chip and electronic equipment, aiming to so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003H04R2410/00
Inventor 张贺存邱冠勋刘松
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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