A semiconductor material crushing device and method using low temperature intervention
A pulverizing device and semiconductor technology, used in grain processing and other directions, can solve the problems of difficult pulverization process, high hardness of semiconductor materials, and large pulverizing space, saving labor, improving pulverizing efficiency, and reducing agglomerated particles.
Active Publication Date: 2022-07-26
东和半导体设备研究开发(苏州)有限公司
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Problems solved by technology
[0011] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor material crushing device and method using low temperature intervention, which solves the existing semiconductor material crushing process. The hardness of the semiconductor material itself is relatively high, which makes it difficult to carry out the subsequent crushing process. The efficiency is low, the precision of crushing is low, the space for crushing is large, and the problem of manual cutting is required
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[0042] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. see Figure 1-4 , an embodiment of the present invention provides a technical solution: a semiconductor material pulverization device using low temperature intervention, comprising a first chassis 1 and a second chassis 2 arranged side by side from left to right, and a right bottom chassis 2 on top of the second chassis 2 A primary crushing mechanism 3 is provided on the side, a low temperature intervention mechanism 4 is provided at t...
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The invention discloses a semiconductor material pulverizing device and method using low temperature intervention, comprising a first chassis and a second chassis arranged side by side from left to right, a primary pulverizing mechanism is disposed on the right side of the top of the second chassis, and a second chassis is arranged side by side from left to right The bottom of the inner wall of a chassis is provided with a low temperature intervention mechanism, and both sides above the inner wall of the first chassis are rotatably connected with rotating shafts. The invention relates to the technical field of semiconductor material processing. The device and method for pulverizing semiconductor materials using low-temperature intervention, a primary pulverizing mechanism is provided on the right side of the top of the second chassis, and a low-temperature intervention mechanism is provided at the bottom of the inner wall of the first chassis, and the cryogenic box and the condenser in the low-temperature intervention mechanism are used. , control box and wires, can embrittle the semiconductor material first, and the subsequent crushing process is easier to carry out, with the primary crushing mechanism to carry out the reciprocating rolling process in the crushing box, the preliminary crushing process of the semiconductor material, reduce the crushing time, improve the crushing efficiency.
Description
technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a semiconductor material crushing device and method using low temperature intervention. Background technique [0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature; semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors . [0003] Referring to the Chinese patent, a semiconductor material pulverizing device (publication number: CN206996775U, publication date: 2018-02-13), the semiconductor material pulverizing device, through the provision of grinding discs, grinding plates, protrusions and grooves, achieves semiconductor Grinding and crushing of materials, grinding and crushing make the crushing more thorou...
Claims
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IPC IPC(8): B02C19/18B02C1/00B02C23/00
CPCB02C19/186B02C1/00B02C23/00
Inventor 吴银雪
Owner 东和半导体设备研究开发(苏州)有限公司